


Bourns, Inc.
4820P-T02-271
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4820P-T02-271 Description
4820P-T02-271 Description
The 4820P-T02-271 from Bourns Inc. is a high-performance 19-resistor bussed network designed for precision surface-mount applications. Encased in a compact 20-pin SOIC package, this resistor array features a 270Ω resistance per element with a tight ±2% tolerance, ensuring reliable signal conditioning and voltage division in dense PCB layouts. Its ±100ppm/°C temperature coefficient guarantees stable performance across varying thermal conditions, while the 80mW power rating per element balances efficiency with durability. The device adheres to REACH compliance and is rated MSL 1 (Unlimited), making it suitable for extended storage and handling. Packaged in tubes for automated assembly, it is ideal for high-volume manufacturing.
4820P-T02-271 Features
- 19-resistor bussed network in a space-saving 20-pin SOIC (13.72mm x 5.59mm) footprint.
- 270Ω resistance with ±2% tolerance for precise circuit matching.
- Low TCR (±100ppm/°C) ensures minimal resistance drift under thermal stress.
- 80mW power dissipation per element for robust operation in low-power designs.
- Surface-mount (SMD) compatibility with 0.094" (2.40mm) max height, suitable for thin-profile applications.
- REACH Affected and EAR99/ECCN compliant, meeting global environmental and export standards.
- MSL 1 (Unlimited) rating allows flexible storage without dry packing.
4820P-T02-271 Applications
This resistor array excels in:
- Voltage division and pull-up/down networks in microcontrollers, FPGAs, and digital logic circuits.
- Signal conditioning for sensors, ADCs, and DACs in industrial automation and IoT devices.
- Impedance matching in communication interfaces (e.g., SPI, I²C).
- Space-constrained designs like wearables and medical electronics, leveraging its compact SOIC form factor.
- Automotive and aerospace systems requiring stable performance across temperature ranges.
Conclusion of 4820P-T02-271
The 4820P-T02-271 stands out for its precision, thermal stability, and compact design, offering engineers a reliable solution for bussed resistor networks. Its combination of tight tolerance, low TCR, and high power efficiency makes it superior to generic arrays in critical applications. Whether for prototyping or mass production, this Bourns component delivers consistent performance in demanding environments.



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