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4820P-T02-331LF

4820P-T02-331LF Description

The 4820P-T02-331LF from Bourns Inc. is a high-performance 19-resistor bussed network designed for precision surface-mount applications. Encased in a compact 20-pin SOIC package, this resistor array offers a 330Ω resistance per element with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. Its 80mW power rating per element and 13.72mm x 5.59mm footprint make it ideal for space-constrained designs. The device is RoHS3 compliant, REACH unaffected, and rated MSL 1 (Unlimited), guaranteeing reliability in manufacturing and end-use environments.

4820P-T02-331LF Features

• 19-resistor bussed network for simplified circuit design.
• 330Ω resistance with ±2% tolerance for precision applications.
• Low ±100ppm/°C TCR ensures minimal resistance drift.
• 80mW power dissipation per element for robust performance.
• Compact 20-SOIC package (13.72mm x 5.59mm, 2.40mm height) saves PCB space.
• RoHS3 compliant, REACH unaffected, and MSL 1 rated for environmental and handling reliability.
• Tube packaging for secure shipping and automated assembly.

4820P-T02-331LF Applications

This resistor array excels in analog signal conditioning, pull-up/pull-down networks, and voltage divider circuits. Its bussed configuration simplifies PCB layouts in industrial control systems, automotive electronics, and communication devices. The low TCR and tight tolerance make it suitable for precision instrumentation, medical equipment, and sensor interfaces. Additionally, its high power rating supports power management circuits in consumer electronics and embedded systems.

Conclusion of 4820P-T02-331LF

The 4820P-T02-331LF stands out as a reliable, space-efficient resistor network for demanding applications. Its combination of precision, thermal stability, and compact design makes it a superior choice over generic arrays. Whether for high-density PCBs or precision analog circuits, this Bourns product delivers consistent performance and manufacturing flexibility, aligning with modern automotive, industrial, and consumer electronics requirements.