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4820P-T02-332

4820P-T02-332 Description

The 4820P-T02-332 from Bourns Inc. is a high-performance 19-resistor bussed network in a compact 20-pin SOIC package, designed for surface-mount applications. With a 3.3kΩ resistance per element and a tight ±2% tolerance, this device ensures reliable signal conditioning and voltage division in precision circuits. Its ±100ppm/°C temperature coefficient guarantees stable performance across varying environmental conditions, while the 80mW power rating per resistor balances efficiency and durability. The 4800P series construction offers robust REACH-compliant materials, and its MSL 1 (Unlimited) rating simplifies handling and storage.

4820P-T02-332 Features

• 19-resistor bussed array in a space-saving 13.72mm x 5.59mm (0.540" x 0.220") footprint.
• 3.3kΩ resistance with ±2% tolerance for consistent performance.
• Low TCR (±100ppm/°C) minimizes resistance drift under thermal stress.
• 80mW power dissipation per element ensures reliability in demanding circuits.
• Surface-mount (SOIC) package with 2.40mm (0.094") height for low-profile designs.
• MSL 1 (Unlimited) and REACH Affected compliance for global usability.

4820P-T02-332 Applications

Ideal for analog signal processing, voltage division, and pull-up/pull-down networks in:

• Industrial automation systems requiring stable resistor networks.
• Consumer electronics (e.g., displays, audio equipment) for signal conditioning.
• Telecommunications infrastructure where precision and compactness are critical.
• Medical devices benefiting from low thermal drift and high reliability.

Conclusion of 4820P-T02-332

The 4820P-T02-332 stands out for its high-density integration, precision tolerance, and thermal stability, making it a superior choice for applications demanding repeatable performance in constrained spaces. Its bussed architecture simplifies PCB layout, while Bourns' quality ensures long-term reliability. Engineers designing embedded systems, test equipment, or sensor interfaces will find this resistor array an optimal solution for reducing component count and improving signal integrity.