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CAY16-2152F4LF

CAY16-2152F4LF Description

The CAY16-2152F4LF from Bourns Inc. is a high-performance resistor network designed for precision surface-mount applications. This 4-resistor array features isolated circuit topology, housed in a compact 1206 (3216 Metric) convex package with long side terminals, measuring 3.20mm x 1.60mm (0.126" x 0.063") with a low-profile height of 0.60mm (0.024"). Each resistor offers a 21.5kΩ ±1% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. With a 62.5mW power rating per element, this RoHS3-compliant and REACH-unaffected component is ideal for densely populated PCBs requiring reliable signal conditioning or voltage division.

CAY16-2152F4LF Features

• Precision Resistance: 21.5kΩ ±1% tolerance for accurate signal processing.
• Stable Performance: Low TCR (±200ppm/°C) minimizes drift under thermal stress.
• Compact Design: 1206 package with convex, long-side terminals for robust mechanical stability.
• High Reliability: Moisture Sensitivity Level (MSL) 1 (Unlimited) ensures compatibility with extended storage and handling.
• Surface-Mount Ready: Tape & Reel (TR) packaging for automated assembly efficiency.
• Isolated Circuitry: Independent resistors reduce crosstalk in multi-channel designs.

CAY16-2152F4LF Applications

This resistor array excels in applications demanding precision and space efficiency, including:

• Voltage Dividers: Stable reference circuits in sensor interfaces or ADCs.
• Signal Conditioning: Pull-up/pull-down networks in digital communication systems (e.g., I2C, SPI).
• Industrial Electronics: PLCs, motor controls, and instrumentation where thermal stability is critical.
• Consumer Electronics: Compact designs like wearables or IoT devices benefit from its low-profile footprint.

Conclusion of CAY16-2152F4LF

The CAY16-2152F4LF combines Bourns' proven reliability with precision engineering, offering a robust solution for modern electronics. Its isolated resistors, tight tolerance, and compact form factor make it superior to generic arrays in applications requiring thermal stability and space optimization. Ideal for both prototyping and mass production, this component is a versatile choice for engineers prioritizing performance and manufacturability.