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BOYD
364424B00032G
219-364424B00032G
PDF Datasheet
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized
14 weeks
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Tech Specifications
HTS
8542.90.00.00
ECCN (US)
EAR99
PPAP
Unknown
Material
Aluminum
Automotive
Unknown
Mounting
Adhesive
Type
Passive
Product Length (mm)
40
364424B00032G Description
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized
FAQ
What is 364424B00032G?
364424B00032G is a Heat Sinks from BOYD. This product page provides its main specifications, pricing information, availability, and inquiry options.
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