Broadcom_BCM55045B1IFSBG
Broadcom_BCM55045B1IFSBG

Broadcom
BCM55045B1IFSBG  
System On Chip (SoC)

Broadcom
BCM55045B1IFSBG
777-BCM55045B1IFSBG
10G XPON DPU CHIP
In Stock : Please Inquiry

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ
ADD TO RFQ LIST
ersa FreeSample
ISO9001
Quality Policy
ISO45001
ISO14001

BCM55045B1IFSBG Description

BCM55045B1IFSBG Description

The BCM55045B1IFSBG is a high-performance 10G XPON DPU (Digital Processing Unit) chip developed by Broadcom Limited, designed for next-generation passive optical network (PON) systems. As an Active product, it is packaged in a Tray format, ensuring robust handling and integration into advanced networking equipment. This System on Chip (SoC) is engineered to deliver ultra-fast data transmission, low latency, and superior power efficiency, making it ideal for modern fiber-optic communication infrastructures.

BCM55045B1IFSBG Features

  • 10G XPON Support: Enables high-speed data transfer rates up to 10 Gbps, meeting the demands of bandwidth-intensive applications.
  • Integrated DPU Architecture: Combines processing, switching, and traffic management into a single chip, reducing system complexity and BOM costs.
  • Low Power Consumption: Optimized for energy efficiency, critical for carrier-grade deployments.
  • Advanced QoS & Security: Features hardware-accelerated encryption and deep packet inspection for secure, reliable service delivery.
  • Broadcom Proven Reliability: Leverages Broadcom’s expertise in networking silicon for long-term stability and performance.

Compared to similar models, the BCM55045B1IFSBG stands out with its tight integration of XPON-specific functions, eliminating the need for external PHYs or coprocessors.

BCM55045B1IFSBG Applications

This chip is ideal for:

  • Fiber-to-the-Home (FTTH) Networks: Provides the backbone for ISPs offering ultra-high-speed internet, VoIP, and IPTV services.
  • 5G Backhaul Solutions: Ensures low-latency, high-throughput connectivity for mobile network operators.
  • Enterprise GPON/XPON Equipment: Used in OLTs (Optical Line Terminals) and ONUs (Optical Network Units) for scalable, future-proof deployments.
  • Smart City Infrastructure: Supports resilient, high-capacity communication for IoT and municipal networks.

Conclusion of BCM55045B1IFSBG

The BCM55045B1IFSBG is a cutting-edge 10G XPON DPU solution that combines performance, integration, and efficiency for next-gen optical access networks. Its single-chip architecture, carrier-grade features, and Broadcom’s industry leadership make it a superior choice for telecom operators, ISPs, and network equipment manufacturers seeking to deploy scalable, high-performance PON systems.

Tech Specifications

Core Processor
Speed
Operating Temperature
Architecture
Flash Size
RAM Size
Number of I/O
Peripherals
Product Status
Supplier Device Package
Series
Package / Case
Mfr
Connectivity
Package
Primary Attributes
Technology
RoHS

BCM55045B1IFSBG Documents

Download datasheets and manufacturer documentation for BCM55045B1IFSBG

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service