BCM55045B1IFSBG Description
The BCM55045B1IFSBG is a high-performance 10G XPON DPU (Digital Processing Unit) chip developed by Broadcom Limited, designed for next-generation passive optical network (PON) systems. As an Active product, it is packaged in a Tray format, ensuring robust handling and integration into advanced networking equipment. This System on Chip (SoC) is engineered to deliver ultra-fast data transmission, low latency, and superior power efficiency, making it ideal for modern fiber-optic communication infrastructures.
BCM55045B1IFSBG Features
- 10G XPON Support: Enables high-speed data transfer rates up to 10 Gbps, meeting the demands of bandwidth-intensive applications.
- Integrated DPU Architecture: Combines processing, switching, and traffic management into a single chip, reducing system complexity and BOM costs.
- Low Power Consumption: Optimized for energy efficiency, critical for carrier-grade deployments.
- Advanced QoS & Security: Features hardware-accelerated encryption and deep packet inspection for secure, reliable service delivery.
- Broadcom Proven Reliability: Leverages Broadcom’s expertise in networking silicon for long-term stability and performance.
Compared to similar models, the BCM55045B1IFSBG stands out with its tight integration of XPON-specific functions, eliminating the need for external PHYs or coprocessors.
BCM55045B1IFSBG Applications
This chip is ideal for:
- Fiber-to-the-Home (FTTH) Networks: Provides the backbone for ISPs offering ultra-high-speed internet, VoIP, and IPTV services.
- 5G Backhaul Solutions: Ensures low-latency, high-throughput connectivity for mobile network operators.
- Enterprise GPON/XPON Equipment: Used in OLTs (Optical Line Terminals) and ONUs (Optical Network Units) for scalable, future-proof deployments.
- Smart City Infrastructure: Supports resilient, high-capacity communication for IoT and municipal networks.
Conclusion of BCM55045B1IFSBG
The BCM55045B1IFSBG is a cutting-edge 10G XPON DPU solution that combines performance, integration, and efficiency for next-gen optical access networks. Its single-chip architecture, carrier-grade features, and Broadcom’s industry leadership make it a superior choice for telecom operators, ISPs, and network equipment manufacturers seeking to deploy scalable, high-performance PON systems.
BCM55045B1IFSBG Documents
Download datasheets and manufacturer documentation for BCM55045B1IFSBG