Broadcom_BCM56846A1IFTBG
Broadcom_BCM56846A1IFTBG

Broadcom
BCM56846A1IFTBG  
Encoders, Decoders, Multiplexers & Demultiplexers

Broadcom
BCM56846A1IFTBG
743-BCM56846A1IFTBG
MULTI LAYER SWITCH
In Stock : Please Inquiry

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ
ADD TO RFQ LIST
ersa FreeSample
ISO9001
Quality Policy
ISO45001
ISO14001

BCM56846A1IFTBG Description

BCM56846A1IFTBG Description

The BCM56846A1IFTBG is a multi-layer switch designed by Broadcom Limited, a leading manufacturer in the semiconductor industry. This Logic IC Chip is part of the obsolete product line, indicated by its ECCN and Product Status classifications. Despite its obsolete status, the BCM56846A1IFTBG remains a significant component in various networking applications due to its robust performance and advanced features.

The BCM56846A1IFTBG is packaged in a tray format, which is ideal for bulk handling and storage in manufacturing environments. It is categorized under the Logic IC Chips category, which encompasses a wide range of integrated circuits used for various logical operations in electronic systems. The base product number BCM56846 signifies its core design and functionality, while the specific variant A1IFTBG denotes additional attributes such as package type and performance enhancements.

BCM56846A1IFTBG Features

The BCM56846A1IFTBG is equipped with several unique features that set it apart from similar models in the market. Key features include:

  • Multi-Layer Switching Capabilities: This IC chip supports advanced multi-layer switching, enabling efficient data routing and management across different network layers.
  • High-Performance Processing: The BCM56846A1IFTBG is designed to handle high-speed data processing, ensuring minimal latency and optimal performance in demanding networking environments.
  • Enhanced Security Features: Integrated security mechanisms safeguard against unauthorized access and data breaches, ensuring the integrity and confidentiality of network communications.
  • Scalability: The chip is designed to be scalable, allowing it to adapt to growing network demands and support a wide range of applications from small to large enterprises.
  • Vendor-Undefined Moisture Sensitivity Level (MSL): This feature provides flexibility in handling and storage conditions, making it suitable for various manufacturing processes and environments.

BCM56846A1IFTBG Applications

The BCM56846A1IFTBG is ideal for a variety of applications, particularly in the networking and telecommunications sectors. Specific use cases include:

  • Enterprise Networking: The chip's multi-layer switching capabilities make it suitable for managing complex enterprise networks, ensuring efficient data flow and connectivity.
  • Data Centers: High-performance processing and scalability features enable the BCM56846A1IFTBG to support the demanding requirements of modern data centers.
  • Telecommunications Infrastructure: The enhanced security features and robust performance make it an ideal component for critical telecommunications applications, ensuring reliable and secure communication.
  • Industrial Networks: The BCM56846A1IFTBG can be utilized in industrial settings where reliable and efficient data routing is essential for maintaining operational continuity.

Conclusion of BCM56846A1IFTBG

Despite being classified as obsolete, the BCM56846A1IFTBG remains a valuable component in the electronics industry due to its advanced features and robust performance. Its multi-layer switching capabilities, high-speed processing, and enhanced security features make it an ideal choice for a wide range of networking applications. The scalability and flexibility provided by the vendor-undefined moisture sensitivity level further enhance its usability in various manufacturing and operational environments. For those seeking a reliable and high-performance Logic IC Chip, the BCM56846A1IFTBG is a worthy consideration, even in its obsolete status.

Tech Specifications

Operating Temperature
ECCN
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Base Product Number
Moisture Sensitivity Level (MSL)

BCM56846A1IFTBG Documents

Download datasheets and manufacturer documentation for BCM56846A1IFTBG

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service