Broadcom

BCM82757AKFSBG  

Telecom

BCM82757AKFSBG Description

The BCM82757AKFS isBG a high-performance PHY 10GBE SFI-XFI EDC/LRM Interface IC Chip, designed by Broadcom Limited. This chip is housed in a 144BGA package and is currently active in the market. It is available in a tray package format, making it suitable for various industrial applications. The BCM82757AKFSBG supports multiple interfaces, including PHY, SFI, and XFI, providing flexibility and versatility in network connectivity. The chip is ROHS3 compliant, ensuring it meets the latest environmental and safety standards. Additionally, it has a Moisture Sensitivity Level (MSL) of 4, which means it can be safely stored for up to 72 hours in a controlled environment before being used in manufacturing processes.

BCM82757AKFSBG Features

The BCM82757AKFSBG is equipped with several advanced features that set it apart from similar models in the market. Key features include:

• Enhanced Data Communication: The chip supports Enhanced Data Communication (EDC) and Long-Reach Multimode (LRM) capabilities, ensuring robust and reliable data transmission over extended distances.
• High-Speed Interface Support: With support for PHY, SFI, and XFI interfaces, the BCM82757AKFSBG can seamlessly integrate with various high-speed networking devices and systems.
• Compliance and Reliability: ROHS3 compliance ensures that the chip is environmentally friendly and safe for use in a wide range of applications. The MSL 4 rating guarantees that the chip can be stored and handled without compromising its performance or reliability.
• Advanced Packaging: The 144BGA package offers a compact and efficient design, making it ideal for space-constrained applications while maintaining high performance.

BCM82757AKFSBG Applications

The BCM82757AKFSBG is ideal for a variety of applications where high-speed data transmission and reliable network connectivity are crucial. Specific use cases include:

• Data Centers: The chip's high-speed interface capabilities make it suitable for use in data centers where large volumes of data need to be processed and transmitted quickly and efficiently.
• Telecommunications: The BCM82757AKBGFS can be used in telecommunications infrastructure to support high-speed data communication between different network nodes.
• Industrial Networks: The chip's robustness and reliability make it ideal for industrial applications where network connectivity is critical for the operation of machinery and systems.
• Enterprise Networking: The BCM82757AKFSBG can be integrated into enterprise networking solutions to provide high-speed connectivity and data transmission between different departments and locations.

Conclusion of BCM82757AKFSBG

The BCM82757AKFSBG is a versatile and high-performance Interface IC Chip that offers significant advantages over similar models. Its support for multiple high-speed interfaces, enhanced data communication capabilities, and advanced packaging make it a reliable choice for a wide range of applications. The chip's ROHS3 compliance and MSL 4 rating ensure that it meets the highest environmental and safety standards, making it a responsible and sustainable choice for modern electronics. Whether used in data centers, telecommunications, industrial networks, or enterprise networking, the BCM82757AKFSBG delivers exceptional performance and reliability, making it a valuable component in any high-speed networking solution.

BCM82757AKFSBG Documents

Download datasheets and manufacturer documentation for BCM82757AKFSBG