Broadcom_BCM8727BIFBG
Broadcom_BCM8727BIFBG
original

Broadcom
BCM8727BIFBG

710-BCM8727BIFBG
PDF Datasheet
Transceiver 2TX 2RX 10Gbps 324-Pin BGA

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Tech Specifications

Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
19
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BCM8727BIFBG Description

BCM8727BIFBG Description

The BCM8727BIFBG is a high-performance, dual-channel 10-Gigabit Ethernet (10-GbE) integrated circuit (IC) manufactured by Broadcom Limited. This advanced IC is designed to meet the demands of modern networking applications, offering exceptional performance and reliability. With its REACH unaffected status, ROHS3 compliance, and ECCN classification, the BCM8727BIFBG is well-suited for a wide range of applications in the electronics industry.

BCM8727BIFBG Features

  1. Dual-Channel 10-GbE Capability: The BCM8727BIFBG supports two independent 10-GbE channels, enabling high-speed data transmission and increased bandwidth for demanding applications.

  2. Broadcom Limited Manufacturing: As a product of Broadcom, the BCM8727BIFBG benefits from the company's expertise in high-speed data communication, ensuring top-notch performance and reliability.

  3. Compliance with Industry Standards: With REACH unaffected status and ROHS3 compliance, the BCM8727BIFBG adheres to stringent environmental and safety regulations, making it suitable for use in various industries.

  4. Low Moisture Sensitivity Level (MSL): The BCM8727BIFBG has an MSL of 1 (Unlimited), indicating minimal sensitivity to moisture, which is crucial for maintaining performance and reliability in various environmental conditions.

  5. Tray Packaging: The IC is available in tray packaging, facilitating easy handling and integration into manufacturing processes.

BCM8727BIFBG Applications

The BCM8727BIFBG is ideal for a variety of high-speed data communication applications, including:

  1. Data Centers: The dual-channel 10-GbE capability makes the BCM8727BIFBG well-suited for data center networking, where high-speed data transfer and increased bandwidth are essential.

  2. Enterprise Networking: The BCM8727BIFBG can be used in enterprise networks to support high-speed data transfer between servers, storage devices, and other network components.

  3. Telecommunications: The IC is suitable for telecommunications applications, such as high-speed internet service provider (ISP) networks, where reliable and high-performance data communication is critical.

  4. Industrial Automation: The BCM8727BIFBG can be used in industrial automation systems to enable high-speed communication between control systems, sensors, and actuators.

Conclusion of BCM8727BIFBG

The BCM8727BIFBG is a versatile and high-performance IC designed for demanding data communication applications. Its dual-channel 10-GbE capability, compliance with industry standards, and low moisture sensitivity level make it an excellent choice for data centers, enterprise networks, telecommunications, and industrial automation. With its unique features and advantages over similar models, the BCM8727BIFBG is a reliable and efficient solution for high-speed data communication needs.

FAQ

What package or case is BCM8727BIFBG available in?
BCM8727BIFBG is available in the Ball Grid Array package / case.
What is BCM8727BIFBG?
What is the mounting type of BCM8727BIFBG?
Is BCM8727BIFBG currently in stock?
What voltage specification is listed for BCM8727BIFBG?
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