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congatec
CONGA-PA7/HSP-B
219-CONGA-PA7/HSP-B
PDF Datasheet
Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm borehole
9 Weeks
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Tech Specifications
Mounting Style
Through Hole
Series
conga-PA7 Intel Elkhart Lake
ECCN
EAR99
Product
Heat Spreaders
USHTS
8473305100
Designed for
conga-PA7
RoHS
RoHS Compliant
CONGA-PA7/HSP-B Description
Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm borehole
FAQ
What is CONGA-PA7/HSP-B?
CONGA-PA7/HSP-B is a Heat Sinks from congatec. This product page provides its main specifications, pricing information, availability, and inquiry options.
What is the mounting type of CONGA-PA7/HSP-B?
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