
congatec
CONGA-QMX6/HSP3-T
219-CONGA-QMX6/HSP3-T
Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
Mounting Style
Screw
Series
conga-QMX6
Type
Component
ECCN
EAR99
Product
Heat Spreaders
USHTS
8542310075
Designed for
BGA
RoHS
RoHS Compliant
CONGA-QMX6/HSP3-T Description
Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
FAQ
What is CONGA-QMX6/HSP3-T?
CONGA-QMX6/HSP3-T is a Heat Sinks from congatec. This product page provides its main specifications, pricing information, availability, and inquiry options.
What is the mounting type of CONGA-QMX6/HSP3-T?
Is CONGA-QMX6/HSP3-T currently in stock?
Are there related or alternative parts for CONGA-QMX6/HSP3-T?



.png)




















.png?x-oss-process=image/format,webp/resize,h_32)










