congatec
CONGA-QMX6/HSP3-T

219-CONGA-QMX6/HSP3-T
Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

Mounting Style
Screw
Series
conga-QMX6
Type
Component
ECCN
EAR99
Product
Heat Spreaders
USHTS
8542310075
Designed for
BGA
RoHS
RoHS Compliant

CONGA-QMX6/HSP3-T Description

Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.

FAQ

What is CONGA-QMX6/HSP3-T?
CONGA-QMX6/HSP3-T is a Heat Sinks from congatec. This product page provides its main specifications, pricing information, availability, and inquiry options.
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