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752091103JPTR7

752091103JPTR7 Description

The 752091103JPTR7 is an 8-resistor bussed network from CTS Resistor Products, designed for high-density surface-mount applications. This obsolete but REACH-unaffected component features a compact footprint of 0.515" x 0.080" (13.08mm x 2.03mm) with a low-profile height of 0.100" (2.53mm), making it suitable for space-constrained PCB designs. The array provides a 10kΩ resistance per element with a ±5% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across industrial temperature ranges. Packaged in Tape & Reel (TR) for automated assembly, it adheres to ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity, simplifying handling and storage.

752091103JPTR7 Features

• Bussed Circuit Topology: Simplifies layout by connecting resistors in a shared configuration, reducing component count.
• High Power Handling: 80mW per resistor enables robust performance in signal conditioning and pull-up/down circuits.
• Industrial-Grade Stability: ±200ppm/°C TCR ensures reliability in varying thermal environments.
• Compact SMT Design: Ultra-thin 2.53mm profile and 9-pin configuration optimize board space.
• Automation-Ready Packaging: Tape & Reel format supports high-volume PCB assembly.

752091103JPTR7 Applications

Ideal for voltage division, impedance matching, and termination networks in:

• Consumer Electronics: LCD backlighting, keyboard matrix circuits.
• Industrial Controls: PLCs, sensor interfaces, and power management modules.
• Telecom Infrastructure: Line termination in high-speed data transmission.
• Automotive Systems: ECU signal conditioning (non-safety-critical).

Conclusion of 752091103JPTR7

While marked obsolete, the 752091103JPTR7 remains a viable choice for legacy designs requiring a cost-effective, space-saving resistor network with moderate precision. Its bussed architecture, RoHS compliance, and industrial-grade specs make it suitable for prototyping or sustaining existing systems. Engineers should verify alternative availability for long-term projects but can leverage its low-profile, high-density advantages for compact SMT layouts.