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752201223JP
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752201223JP Description
752201223JP Description
The 752201223JP from CTS Resistor Products (a division of CTS Corporation) is an 18-resistor bussed network array designed for surface-mount applications. This obsolete but REACH-unaffected component offers a 22kΩ resistance per element with a ±5% tolerance, making it suitable for precision circuits where moderate resistance values are required. The array is housed in a compact 20-pin package with dimensions of 0.565" x 0.080" (14.35mm x 2.03mm) and a low-profile 0.100" (2.53mm) seated height, ideal for space-constrained PCB designs. Its ±200ppm/°C temperature coefficient ensures stable performance across varying thermal conditions.
752201223JP Features
- High-Density Integration: Combines 18 resistors in a single 20-pin surface-mount package, reducing PCB footprint and assembly complexity.
- Robust Performance: 80mW power rating per element and ROHS3 compliance ensure reliability in environmentally conscious designs.
- Stable Thermal Characteristics: ±200ppm/°C TCR minimizes resistance drift under thermal stress.
- MSL 1 (Unlimited): Suitable for extended storage and handling without moisture sensitivity concerns.
- Bussed Circuit Configuration: Simplifies design for common-node applications like pull-up/pull-down networks.
752201223JP Applications
This resistor array excels in:
- Signal Conditioning: Voltage division and current limiting in sensor interfaces and ADC/DAC circuits.
- Digital Logic: Pull-up/down networks for I2C, SPI, or GPIO lines in microcontrollers and FPGAs.
- Power Management: Load balancing in low-power DC/DC converters or LED driver circuits.
- Legacy Systems: Maintenance or repair of older electronics where obsolete components are required.
Conclusion of 752201223JP
The 752201223JP is a cost-effective, space-saving solution for designs requiring multiple 22kΩ resistors with moderate precision. While obsolete, its REACH compliance, thermal stability, and bussed architecture make it a practical choice for prototyping, legacy systems, or high-density PCBs. Engineers should evaluate alternative active-series models for new designs but can rely on this array for repairs or low-volume production.



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