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753121102GPTR7

753121102GPTR7 Description

The 753121102GPTR7 from CTS Resistor Products (a division of CTS Corporation) is a high-performance 11-resistor bussed network designed for precision surface-mount applications. This ROHS3 Compliant and REACH Unaffected component features a compact 0.345" x 0.080" (8.76mm x 2.03mm) footprint with a low-profile 0.100" (2.53mm) seated height, making it ideal for space-constrained PCB designs. The array provides 1kΩ resistance per element with a tight ±2% tolerance and a stable ±200ppm/°C temperature coefficient, ensuring reliable performance across varying environmental conditions. Packaged in Tape & Reel (TR) for automated assembly, it is MSL 1 (Unlimited) rated, eliminating baking requirements before use.

753121102GPTR7 Features

• 11-resistor bussed network with 12 pins for simplified circuit design.
• 40mW power rating per element, suitable for low-power signal conditioning.
• Surface-mount (SMT) construction for high-density PCB layouts.
• Wide operating temperature range supported by a ±200ppm/°C TCR, ensuring stability.
• Compact 8.76mm x 2.03mm size with a 2.53mm max height, optimizing board space.
• Tape & Reel packaging for efficient pick-and-place assembly.
• ROHS3/REACH compliant, meeting stringent environmental regulations.

753121102GPTR7 Applications

This resistor network excels in precision analog/digital circuits, including:

• Voltage dividers and pull-up/pull-down networks in microcontrollers.
• Signal termination for communication interfaces (I²C, SPI).
• Sensor conditioning circuits where consistent resistance matching is critical.
• Consumer electronics, industrial controls, and automotive subsystems requiring robust, space-saving solutions.
  Its bussed configuration reduces component count, simplifying BOMs in multi-channel systems.

Conclusion of 753121102GPTR7

The 753121102GPTR7 combines high density, stable performance, and ease of integration, making it a superior choice for modern electronics. Its low TCR, tight tolerance, and automation-friendly packaging cater to demanding applications while adhering to environmental standards. Engineers designing compact, reliable circuits will benefit from its optimized balance of size, precision, and power handling.