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766161332GPTR13

766161332GPTR13 Description

The 766161332GPTR13 from CTS Resistor Products is a high-performance 15-resistor bussed network designed for precision surface-mount applications. Encased in a compact 16-pin SOIC package (9.90mm x 3.90mm), it offers a 3.3kΩ resistance per element with a tight ±2% tolerance and a low ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. Compliant with ROHS3 and REACH standards, this 80mW power-rated array is ideal for dense PCB layouts, featuring a 1.75mm profile for low-profile designs. Its tape-and-reel (TR) packaging facilitates automated assembly, while MSL 1 (Unlimited) certification guarantees reliability in humid environments.

766161332GPTR13 Features

• 15-resistor bussed network in a 16-pin SOIC footprint for space efficiency.
• 3.3kΩ ±2% tolerance with ±100ppm/°C TCR for precision signal conditioning.
• 80mW power dissipation per element and 1.75mm max height for thermal and spatial optimization.
• ROHS3/REACH compliant and MSL 1-rated, ensuring environmental and handling robustness.
• Tape-and-reel packaging for streamlined high-volume assembly.
• Wide operating temperature range (-55°C to +125°C) for industrial-grade reliability.

766161332GPTR13 Applications

This resistor array excels in:

• Voltage division and pull-up/down networks in IoT sensors and microcontrollers.
• Signal termination and impedance matching for high-speed communication PCBs.
• Power supply decoupling in consumer electronics (e.g., smart TVs, wearables).
• Industrial automation systems requiring stable, compact resistor networks.
• Automotive ECUs where low TCR and high density are critical.

Conclusion of 766161332GPTR13

The 766161332GPTR13 combines CTS’s reliability with a space-saving design, making it a superior choice for applications demanding precision, durability, and miniaturization. Its bussed architecture, low TCR, and compliance with stringent standards position it ahead of generic arrays, particularly in automotive, industrial, and high-density consumer electronics. Engineers benefit from its ease of integration and consistent performance, reducing design complexity and BOM risk.