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RT2722B7TR7

RT2722B7TR7 Description

The RT2722B7TR7 from CTS Resistor Products is a high-density 48-resistor network array designed for precision termination in LVDS (Low-Voltage Differential Signaling) applications. Housed in a compact 64-pin LBGA package with dimensions of 16.00mm x 4.00mm (0.630" x 0.157"), this surface-mount component offers a dual-terminator circuit configuration with resistances of 140Ω and 165Ω at a tight tolerance of ±1%. Its ±200ppm/°C temperature coefficient ensures stable performance across varying thermal conditions, while the 68mW power rating per element supports robust signal integrity. The device is RoHS compliant and features a moisture sensitivity level (MSL) of 1, making it suitable for extended storage and handling.

RT2722B7TR7 Features

• High-Density Integration: 48 resistors in a space-saving 64-pin LBGA, ideal for PCB-constrained designs.
• Precision Performance: ±1% tolerance and ±200ppm/°C TCR for reliable signal termination in high-speed interfaces.
• LVDS-Optimized: Dual-terminator topology tailored for LVDS applications, reducing signal reflection and EMI.
• Robust Construction: 1.34mm (0.053") seated height and tape & reel (TR) packaging for automated assembly efficiency.
• Compliance: RoHS compliant, REACH unaffected, and ECCN EAR99 for global market compatibility.

RT2722B7TR7 Applications

• High-Speed Data Transmission: Terminating LVDS lines in SerDes (Serializer/Deserializer) systems, FPD-Link, and camera interfaces.
• Embedded Systems: Signal integrity management in industrial automation, automotive infotainment, and medical imaging.
• Telecommunications: Reducing skew and noise in backplane connectors and high-frequency PCBs.
• Consumer Electronics: Compact solutions for 4K/8K displays, drones, and AR/VR hardware requiring low-power termination.

Conclusion of RT2722B7TR7

The RT2722B7TR7 stands out as a high-performance resistor network for LVDS termination, combining precision, miniaturization, and reliability. Its dual-resistance values (140Ω/165Ω) and low-profile design address critical challenges in high-speed digital systems, while its obsolete status may necessitate alternative sourcing for new designs. Engineers seeking low-EMI, space-efficient solutions for signal integrity will find this component indispensable in advanced communication and embedded applications.