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S41C083102FP
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S41C083102FP Description
S41C083102FP Description
The S41C083102FP from CTS Resistor Products is a high-performance 4-resistor array designed for precision applications in modern electronics. Packaged in an 0804 (Convex, Long Side Terminals) form factor, it features a compact 2.00mm x 1.00mm footprint with a low-profile height of 0.45mm, making it ideal for space-constrained designs. Each resistor offers a 1kΩ resistance with a tight ±1% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The device operates at 31.25mW power per element and is RoHS3 compliant, meeting stringent environmental standards.
S41C083102FP Features
- 4 isolated resistors in a single 8-pin package, reducing board space and simplifying layout.
- 0804 convex package with long-side terminals for improved mechanical stability and solder joint reliability.
- Low-profile design (0.45mm) suitable for high-density PCB assemblies.
- ±1% tolerance and ±200ppm/°C TCR for precision signal conditioning.
- 31.25mW power rating per resistor, balancing performance and thermal management.
- MSL 1 (Unlimited) moisture sensitivity, ensuring ease of handling and storage.
- REACH unaffected and RoHS3 compliant, adhering to global environmental regulations.
S41C083102FP Applications
This resistor array excels in DDR SDRAM, DRAM, and MDDR memory modules, where precise termination and signal integrity are critical. Its compact size and high reliability make it suitable for:
- Server and computing motherboards requiring stable termination networks.
- High-speed data buses in networking equipment and telecommunications hardware.
- Portable electronics (e.g., smartphones, tablets) where space-saving components are essential.
- Automotive infotainment systems demanding robust performance under thermal stress.
Conclusion of S41C083102FP
The S41C083102FP stands out as a high-density, precision resistor array optimized for modern electronics. Its combination of tight tolerances, low-profile packaging, and reliability makes it a superior choice for memory interfaces and high-speed signal paths. Engineers benefit from its simplified assembly, reduced footprint, and compliance with environmental standards, ensuring long-term performance in demanding applications. Ideal for DDR memory systems and compact PCB designs, this component delivers both technical excellence and cost-effective integration.



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