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S41X083560FP
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S41X083560FP Description
S41X083560FP Description
The S41X083560FP from CTS Resistor Products is a high-performance 4-resistor array designed for precision applications in modern electronics. Packaged in an 0804 (Convex, Long Side Terminals) surface-mount form factor, it features a compact 2.00mm x 1.00mm (0.079" x 0.039") footprint with a low-profile height of 0.45mm (0.018"), making it ideal for space-constrained designs. Each resistor in the array offers a 56Ω resistance with a tight ±1% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The device is RoHS3 compliant and REACH unaffected, meeting stringent environmental and regulatory standards.
S41X083560FP Features
- 4 isolated resistors in a single package, reducing board space and simplifying assembly.
- 31mW power rating per element, suitable for low-power applications.
- 0804 convex package with long-side terminals for improved mechanical stability and solder joint reliability.
- Moisture Sensitivity Level (MSL) 1, allowing unlimited floor life prior to reflow.
- Optimized for DDR SDRAM, DRAM, and MDDR applications, providing precise termination and signal integrity.
- Tape & Reel (TR) packaging for automated pick-and-place assembly efficiency.
S41X083560FP Applications
This resistor array excels in high-speed memory interfaces, particularly in DDR memory modules, where consistent impedance matching and minimal parasitic effects are critical. Its low-profile design and stable thermal performance make it suitable for:
- Server and workstation memory subsystems
- Embedded systems requiring compact termination networks
- Consumer electronics with dense PCB layouts
- Automotive infotainment and ADAS modules where reliability is paramount
Conclusion of S41X083560FP
The S41X083560FP stands out as a robust, space-saving solution for precision resistor networks, combining CTS's proven reliability with industry-standard performance. Its low thermal drift, tight tolerance, and optimized package make it a superior choice for memory termination and signal conditioning in high-speed digital systems. Engineers can leverage its ease of integration and compliance with environmental regulations to enhance design efficiency and product longevity.



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