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S42C083183FP

S42C083183FP Description

The S42C083183FP from CTS Resistor Products is a high-performance 4-resistor array designed for precision applications in modern electronics. Housed in a compact 1206 (3216 Metric) concave, long-side terminal package, this surface-mount device features isolated resistors with a ±1% tolerance and a ±200ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. Each resistor offers 18kΩ resistance with a 63mW power rating per element, making it suitable for low-power circuits. The 0.022" (0.55mm) seated height and 0.126" x 0.063" (3.20mm x 1.60mm) footprint enable high-density PCB layouts. Compliant with ROHS3 and REACH standards, it is ideal for applications demanding reliability and miniaturization.

S42C083183FP Features

• 4 isolated resistors in a single 1206 concave package, optimizing board space.
• ±1% tolerance and ±200ppm/°C TCR for precision and thermal stability.
• 63mW power rating per resistor, suitable for low-power designs.
• Long-side terminals enhance mechanical stability during mounting.
• Moisture Sensitivity Level (MSL) 1 (Unlimited), ensuring ease of handling and storage.
• Tape & Reel (TR) packaging for automated assembly efficiency.
• ROHS3 and REACH compliant, meeting stringent environmental regulations.

S42C083183FP Applications

This resistor array excels in DDR SDRAM, DRAM, and MDDR memory modules, where precise termination and signal integrity are critical. Its low-profile design and high-density layout make it ideal for space-constrained applications like:

• Server and computing hardware requiring stable voltage division.
• Consumer electronics (e.g., smartphones, tablets) with miniaturized PCBs.
• Industrial control systems demanding robust, temperature-resistant components.
• Automotive electronics where reliability under thermal stress is paramount.

Conclusion of S42C083183FP

The S42C083183FP stands out as a high-reliability, space-saving solution for precision resistor networks. Its concave package, tight tolerance, and low TCR make it superior to standard arrays in applications requiring thermal stability and compactness. With automation-friendly packaging and compliance with global environmental standards, it is a versatile choice for advanced memory systems, industrial, and consumer electronics. Engineers can leverage its performance and durability to enhance signal integrity and reduce footprint in next-generation designs.