Flexxon_FEMC032G-M10
original

Flexxon
FEMC032G-M10

774-FEMC032G-M10
PDF Datasheet
IC FLSH 256GBIT EMMC 5.1 153FBGA
16 Weeks

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Tech Specifications

Clock Frequency
200 MHz
Operating Temperature
-25°C ~ 85°C
Memory Interface
eMMC_5.1
ECCN
3A991B1A
Memory Organization
32G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
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FEMC032G-M10 Description

FEMC032G-M10 Description

The FEMC032G-M10 is a high-performance memory IC chip designed by Flexxon Pte Ltd, part of the ECON II series. This device is a 256Gbit eMMC 5.1 flash memory module, organized as 32G x 8, and is ideal for applications requiring high-density storage and fast data transfer rates. The FEMC032G-M10 operates at a clock frequency of 200 MHz, ensuring efficient and rapid data processing. It supports a supply voltage range of 2.7V to 3.6V, making it compatible with a wide range of electronic systems.

FEMC032G-M10 Features

  • Memory Size and Organization: The FEMC032G-M10 offers a substantial 256Gbit memory size, organized in a 32G x 8 configuration. This architecture provides robust storage capacity and efficient data management.
  • High-Speed Performance: With a clock frequency of 200 MHz, the FEMC032G-M10 ensures high-speed data transfer and processing, making it suitable for demanding applications.
  • eMMC 5.1 Interface: The device supports the eMMC 5.1 interface, which is known for its reliability and compatibility with modern embedded systems.
  • RoHS Compliance: The FEMC032G-M10 is RoHS compliant, ensuring it meets environmental standards and is suitable for use in various industries.
  • Surface Mount Technology: The FEMC032G-M10 is designed for surface mount applications, providing a compact and reliable solution for space-constrained designs.
  • Moisture Sensitivity Level: With an MSL rating of 3 (168 hours), the FEMC032G-M10 is well-suited for manufacturing environments that require protection against moisture.

FEMC032G-M10 Applications

The FEMC032G-M10 is ideal for a variety of applications that demand high-density storage and fast data processing. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems in consumer electronics, automotive, and industrial applications where compact size and high performance are critical.
  • Mobile Devices: Suitable for smartphones, tablets, and other mobile devices that require large storage capacities and quick data access.
  • IoT Devices: Perfect for Internet of Things (IoT) devices that need reliable storage solutions to handle data from sensors and other connected devices.
  • Wearables: The compact size and high performance make the FEMC032G-M10 suitable for wearable technology, ensuring efficient data storage and processing.

Conclusion of FEMC032G-M10

The FEMC032G-M10 is a versatile and high-performance memory IC chip that offers significant advantages over similar models. Its 256Gbit memory size, eMMC 5.1 interface, and 200 MHz clock frequency make it an excellent choice for applications requiring high-density storage and fast data transfer. The device's RoHS compliance and surface mount design further enhance its suitability for modern electronic systems. Whether used in embedded systems, mobile devices, IoT applications, or wearables, the FEMC032G-M10 provides reliable and efficient storage solutions, making it a standout choice in the memory IC market.

FAQ

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The standard lead time for FEMC032G-M10 is 16 Weeks.
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