Flexxon_FEMC064GBE-T740
Flexxon_FEMC064GBE-T740
original

Flexxon
FEMC064GBE-T740

774-FEMC064GBE-T740
PDF Datasheet
IC FLSH 512GBIT EMMC 5.1 153FBGA
20 Weeks

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Tech Specifications

Clock Frequency
200 MHz
Operating Temperature
-40°C ~ 85°C
Memory Interface
eMMC_5.1
ECCN
3A991B1A
Memory Organization
64G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
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FEMC064GBE-T740 Description

FEMC064GBE-T740 Description

The FEMC064GBE-T740 is a high-performance memory IC designed by Flexxon Pte Ltd, featuring a 512Gbit eMMC 5.1 memory format. This advanced memory solution is housed in a 153FBGA package, ensuring robustness and reliability for a wide range of applications. The FEMC064GBE-T740 operates within a voltage supply range of 2.7V to 3.6V, making it highly adaptable to various electronic systems. With a clock frequency of 200 MHz, this memory IC delivers exceptional data transfer speeds, enhancing overall system performance.

FEMC064GBE-T740 Features

  • High Capacity and Organization: The FEMC064GBE-T740 boasts a memory size of 512Gbit, organized as 64G x 8, providing ample storage for complex applications.
  • Advanced Memory Interface: It supports the eMMC 5.1 interface, ensuring compatibility with modern embedded systems and delivering high-speed data access.
  • Wide Voltage Range: The memory IC operates within a voltage supply range of 2.7V to 3.6V, offering flexibility and compatibility with various power supply configurations.
  • Surface Mount Technology: The surface mount mounting type ensures ease of integration into compact and high-density PCB designs.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), the FEMC064GBE-T740 is well-suited for manufacturing environments that require moisture protection.
  • Active Product Status: The FEMC064GBE-T740 is an active product, ensuring continued availability and support from Flexxon Pte Ltd.
  • Series and Packaging: Part of the XTRA VII series, this memory IC is packaged in a tray format, facilitating efficient handling and storage.

FEMC064GBE-T740 Applications

The FEMC064GBE-T740 is ideal for applications requiring high-capacity, high-speed memory solutions. Key use cases include:

  • Embedded Systems: Ideal for embedded systems in consumer electronics, automotive, and industrial applications where compact size and high performance are critical.
  • Mobile Devices: Suitable for smartphones, tablets, and other mobile devices that demand large storage capacities and fast data access.
  • IoT Devices: Provides reliable storage for IoT devices, ensuring efficient data handling and processing in smart home, smart city, and industrial IoT applications.
  • Wearable Technology: The compact form factor and high performance make it suitable for wearable devices, enhancing user experience with quick data retrieval and storage.

Conclusion of FEMC064GBE-T740

The FEMC064GBE-T740 from Flexxon Pte Ltd stands out as a superior memory IC solution, offering a combination of high capacity, advanced memory interface, and wide voltage range. Its robust design, surface mount technology, and moisture sensitivity level make it highly reliable and adaptable to various manufacturing environments. Whether used in embedded systems, mobile devices, IoT applications, or wearable technology, the FEMC064GBE-T740 delivers exceptional performance and reliability, making it a preferred choice for engineers and designers in the electronics industry.

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FEMC064GBE-T740 is a Memory ICs Products from Flexxon. This product page provides its main specifications, pricing information, availability, and inquiry options.
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