Flexxon_FEMC128G-M10
Flexxon_FEMC128G-M10
original

Flexxon
FEMC128G-M10

774-FEMC128G-M10
PDF Datasheet
IC FLASH 1TBIT EMMC 5.1 153FBGA
12 Weeks

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Tech Specifications

Clock Frequency
200 MHz
Operating Temperature
-25°C ~ 85°C
Memory Interface
eMMC_5.1
ECCN
3A991B1A
Memory Organization
128G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
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FEMC128G-M10 Description

FEMC128G-M10 Description

The FEMC128G-M10 is an advanced Memory IC Chip designed by Flexxon Pte Ltd, part of the ECON II series. This IC FLASH 1TBIT eMMC 5.1 153FBGA is engineered to deliver high performance and reliability in a compact surface mount package. The FEMC128G-M10 features a memory organization of 128G x 8, providing a substantial 1Tbit of memory size, making it ideal for applications requiring large storage capacities. It operates within a voltage supply range of 2.7V to 3.6V, ensuring compatibility with a wide range of systems.

FEMC128G-M10 Features

  • High Clock Frequency: The FEMC128G-M10 operates at a clock of frequency 200 MHz, enabling rapid data transfer and processing speeds.
  • Advanced Memory Interface: It supports the eMMC 5.1 interface, which is known for its high-speed data transfer capabilities and efficient power management.
  • Robust Memory Organization: With a memory organization of 128G x 8, the FEMC128G-M10 offers a total memory size of 1Tbit, making it suitable for applications that require extensive storage.
  • Flexible Voltage Range: The IC operates within a voltage supply range of 2.7V to 3.6V, ensuring compatibility with various power supply configurations.
  • Surface Mount Packaging: The FEMC128G-M10 is designed for surface mount applications, making it ideal for modern, space-constrained electronic designs.
  • Moisture Sensitivity Level: With an MSL rating of 3 (168 Hours), the FEMC128G-M10 is well-suited for environments with varying humidity levels, ensuring long-term reliability.
  • ECCN Compliance: The FEMC128G-M10 is classified under ECCN 3A991B1A, ensuring compliance with international export regulations.
  • HTSUS Classification: It is classified under HTSUS 8542.32.0071, facilitating smooth customs clearance and regulatory compliance.

FEMC128G-M10 Applications

The FEMC128G-M10 is ideal for a variety of applications that demand high storage capacity and fast data processing. Some specific use cases include:

  • Consumer Electronics: Smartphones, tablets, and other portable devices benefit from the high-speed data transfer and large storage capacity of the FEMC128G-M10.
  • Industrial Systems Industrial: control systems and IoT devices can leverage the robust memory organization and reliable performance of this IC.
  • Embedded Systems: The FEMC128G-M10 is well-suited for embedded systems in automotive, aerospace, and medical industries, where compact size and high reliability are critical.
  • Data Storage Solutions: The large memory size and efficient power management make the FEMC128G-M10 an excellent choice for data storage applications, including SSDs and NAS devices.

Conclusion of FEMC128G-M10

The FEMC128G-M10 from Flexxon Pte Ltd out stands as a high-performance Memory IC Chip, offering a unique combination of large storage capacity, fast data transfer speeds, and reliable performance. Its advanced features, such as the eMMC 5.1 interface and flexible voltage range, make it a versatile solution for a wide range of applications. The FEMC128G-M10 is an ideal choice for designers and engineers looking for a reliable and efficient memory solution in modern electronic systems.

FAQ

What operating temperature range does FEMC128G-M10 support?
FEMC128G-M10 has an operating temperature range of -25°C ~ 85°C.
Are there related or alternative parts for FEMC128G-M10?
What is the standard lead time for FEMC128G-M10?
What is FEMC128G-M10?
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