GigaDevice_GD25F256FYIGR
original

GigaDevice
GD25F256FYIGR

774-GD25F256FYIGR
PDF Datasheet
IC FLASH 256MBIT SPI/QUAD 8WSON
14 Weeks

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Tech Specifications

Clock Frequency
200 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O
Memory Organization
32M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-WSON (6x8)
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GD25F256FYIGR Description

GD25F256FYIGR Description

The GD25F256FYIGR is a high-performance, 256Mbit SPI/QUAD flash memory IC designed for a wide range of applications requiring reliable and efficient data storage. Manufactured by GigaDevice Semiconductor (HK) Limited, this memory IC belongs to the GD25F series and is packaged in a surface-mount 8WSON format, making it suitable for compact and space-constrained designs. The GD25F256FYIGR operates within a voltage range of 2.7V to 3.6V and supports a clock frequency of up to 200 MHz, ensuring fast data transfer rates and low latency.

GD25F256FYIGR Features

  • Memory Organization: The GD25F256FYIGR features a 32M x 8 memory organization, providing a total memory size of 256Mbit. This configuration allows for efficient storage and retrieval of data, making it ideal for applications requiring large data sets.
  • High-Speed Performance: With a clock frequency of up to 200 MHz, the GD25F256FYIGR offers high-speed data transfer capabilities. This ensures minimal latency and quick access to stored data, enhancing overall system performance.
  • SPI/QUAD Interface: The GD25F256FYIGR supports both SPI and QUAD interfaces, providing flexibility in communication protocols. This dual-interface capability allows for compatibility with a wide range of systems and devices.
  • Wide Voltage Range: Operating within a voltage range of 2.7V to 3.6V, the GD25F256FYIGR is designed to be versatile and compatible with various power supply configurations. This wide voltage range ensures reliable operation in different environmental conditions.
  • Surface-Mount Packaging: The GD25F256FYIGR is available in a surface-mount 8WSON package, which is ideal for compact and space-efficient designs. This packaging option allows for easy integration into modern electronic systems.
  • Tape & Reel Packaging: The GD25F256FYIGR is packaged in tape & reel format, facilitating efficient manufacturing and assembly processes. This packaging method ensures high reliability and ease of handling during production.

GD25F256FYIGR Applications

The GD25F256FYIGR is well-suited for a variety of applications that require high-speed, reliable data storage and retrieval. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems that require non-volatile memory for storing firmware, configuration data, and other critical information.
  • Consumer Electronics: Suitable for consumer electronics devices such as smartphones, tablets, and smart home appliances, where compact size and high performance are essential.
  • Industrial Automation: The GD25F256FYIGR can be used in industrial automation systems for data logging, control algorithms, and other critical functions.
  • Telecommunications: In telecommunications equipment, the GD25F256FYIGR can store configuration data, firmware updates, and other essential information required for smooth operation.
  • Automotive Electronics: The GD25F256FYIGR is also suitable for automotive applications, where it can be used for storing infotainment system data, control algorithms, and other critical information.

Conclusion of GD25F256FYIGR

The GD25F256FYIGR is a high-performance, 256Mbit SPI/QUAD flash memory IC that offers a combination of speed, reliability, and versatility. Its high-speed performance, wide voltage range, and compact surface-mount packaging make it an ideal choice for a wide range of applications. The dual-interface capability and tape & reel packaging further enhance its suitability for modern electronic systems. With its robust features and reliable performance, the GD25F256FYIGR stands out as a superior option in the memory IC market, providing significant advantages over similar models.

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