GigaDevice_GD25LB128EYIGR
original

GigaDevice
GD25LB128EYIGR

774-GD25LB128EYIGR
PDF Datasheet
IC FLASH 128MBIT SPI/QUAD 8WSON
8 Weeks

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Tech Specifications

Clock Frequency
133 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O, QPI, DTR
Memory Organization
16M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-WSON (6x8)
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GD25LB128EYIGR Description

GD25LB128EYIGR Description

The GD25LB128EYIGR is a high-performance, 128Mbit SPI/QUAD Flash memory IC designed by GigaDevice Semiconductor (HK) Limited. This memory IC chip is part of the GD25LB series and is renowned for its robust performance and reliability. The GD25LB128EYIGR features a clock frequency of 133 MHz, ensuring fast data transfer rates and efficient operation. It is organized as 16M x 8, providing a substantial memory capacity in a compact form factor. The memory is housed in a surface mount package, specifically the 8-WSON (8-Wide Small Outline No-lead), which is ideal for space-constrained applications. The IC operates within a voltage range of 1.65V to 2V, making it suitable for low-power applications. The GD25LB128EYIGR is available in a tape and reel (TR) packaging format, facilitating easy integration into automated assembly processes. With its active product status, the GD25LB128EYIGR is a reliable choice for engineers and designers seeking a high-quality flash memory solution.

GD25LB128EYIGR Features

  • High-Speed Performance: The GD25LB128EYIGR operates at a clock frequency of 133 MHz, enabling rapid data read and write operations. This high-speed performance is crucial for applications requiring quick data access and processing.
  • Memory Organization: The memory is organized as 16M x 8, providing a total capacity of 128Mbit. This configuration ensures that the IC can store a significant amount of data while maintaining efficient memory management.
  • Low-Power Operation: With a supply voltage range of 1.65V to 2V, the GD25LB128EYIGR is designed for low-power consumption. This feature is particularly beneficial for battery-operated devices and other applications where energy efficiency is paramount.
  • Surface Mount Technology: The GD25LB128EYIGR is available in an 8-WSON surface mount package, which is ideal for modern, compact electronic designs. This packaging option allows for easy integration into PCBs and supports high-density layouts.
  • SPI/QUAD Interface: The IC supports both SPI and QUAD interfaces, offering flexibility in communication protocols. This dual-interface capability enhances the IC's versatility and compatibility with various microcontrollers and systems.
  • Tape & Reel Packaging: The GD25LB128EYIGR is packaged in tape and reel format, which is ideal for automated assembly processes. This packaging ensures consistent quality and ease of handling during mass production.

GD25LB128EYIGR Applications

The GD25LB128EYIGR is suitable for a wide range of applications due to its high performance, low power consumption, and compact size. Some specific use cases include:

  • Embedded Systems: The GD25LB128EYIGR is ideal for embedded systems requiring non-volatile memory for storing firmware, configuration data, and other critical information. Its low-power operation and high-speed performance make it a perfect fit for battery-operated devices.
  • Consumer Electronics: In consumer electronics, the GD25LB128EYIGR can be used for storing multimedia content, user settings, and other data. Its small form factor and surface mount packaging make it suitable for space-constrained applications such as smartphones, tablets, and wearable devices.
  • Industrial Automation: The robust performance and reliability of the GD25LB128EYIGR make it suitable for industrial automation applications. It can be used for storing control parameters, calibration data, and other essential information in industrial control systems.
  • Automotive Electronics: The GD25LB128EYIGR can be employed in automotive electronics for storing infotainment system data, vehicle configuration settings, and other critical information. Its low-power operation and high-speed performance ensure reliable operation in demanding automotive environments.

Conclusion of GD25LB128EYIGR

The GD25LB128EYIGR is a high-performance, low-power 128Mbit SPI/QUAD Flash memory IC that offers significant advantages over similar models. Its high-speed operation, low-power consumption, and compact surface mount packaging make it an ideal choice for a variety of applications, including embedded systems, consumer electronics, industrial automation, and automotive electronics. The dual-interface capability and tape and reel packaging further enhance its versatility and ease of integration. With its active product status and reliable performance, the GD25LB128EYIGR is a top choice for engineers and designers seeking a high-quality flash memory solution.

FAQ

What operating temperature range does GD25LB128EYIGR support?
GD25LB128EYIGR has an operating temperature range of -40°C ~ 85°C (TA).
Is GD25LB128EYIGR currently in stock?
What is the mounting type of GD25LB128EYIGR?
What is the standard lead time for GD25LB128EYIGR?
What voltage specification is listed for GD25LB128EYIGR?
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