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GD25VE16CEIGR

GD25VE16CEIGR Description

The GD25VE16CEIGR is a high-performance, 16Mbit SPI/QSPI Flash memory IC chip manufactured by GigaDevice Semiconductor (HK) Limited. This device is designed to meet the demanding requirements of modern electronic systems, offering robust performance and reliability. The GD25VE16CEIGR features a memory organization of 2M x 8, supporting a clock frequency of up to 104 MHz, ensuring fast data transfer rates and efficient operation. It operates within a voltage range of 2.1V to 3.6V, making it suitable for a wide range of applications requiring low to moderate power consumption.

The GD25VE16CEIGR is available in a surface-mount 8USON package, which is ideal for compact and space-constrained designs. The device is packaged in tape and reel (TR), facilitating automated assembly processes and ensuring consistent quality. The GD25VE16CEIGR is REACH unaffected and RoHS3 compliant, adhering to stringent environmental and safety standards. It is classified under HTSUS code 8542.32.0071 and has an ECCN of EAR99.

GD25VE16CEIGR Features

• Memory Size and Organization: The GD25VE16CEIGR offers a memory size of 16Mbit, organized as 2M x 8, providing ample storage capacity for various applications.
• Clock Frequency: With a maximum clock frequency of 104 MHz, the GD25VE16CEIGR ensures high-speed data transfer, making it suitable for applications requiring rapid data access and processing.
• Voltage Range: The device operates within a voltage range of 2.1V to 3.6V, offering flexibility in power supply requirements and compatibility with a variety of systems.
• Mounting Type: The surface-mount 8USON package is ideal for compact designs, enabling efficient use of board space and facilitating high-density layouts.
• Environmental Compliance: The GD25VE16CEIGR is REACH unaffected and RoHS3 compliant, ensuring it meets the latest environmental and safety standards.
• Packaging: Available in tape and reel (TR) packaging, the GD25VE16CEIGR is well-suited for automated assembly processes, ensuring consistent quality and reliability.
• Moisture Sensitivity Level: With an MSL of 3 (168 hours), the GD25VE16CEIGR is designed to withstand typical manufacturing conditions, reducing the risk of moisture-related damage.

GD25VE16CEIGR Applications

The GD25VE16CEIGR is ideal for a wide range of applications where high-speed, reliable, and compact memory solutions are required. Some specific use cases include:

• Embedded Systems: Ideal for embedded systems requiring fast and reliable storage for firmware and data.
• Consumer Electronics: Suitable for consumer electronics devices where compact size and low power consumption are critical.
• Industrial Control: Provides robust memory solutions for industrial control systems, ensuring reliable operation in harsh environments.
• Telecommunications: Ideal for telecommunication equipment requiring high-speed data access and storage.
• Automotive Electronics: Suitable for automotive applications where reliability and performance are paramount.

Conclusion of GD25VE16CEIGR

The GD25VE16CEIGR is a versatile and high-performance SPI/QSPI Flash memory IC chip that offers significant advantages over similar models. Its combination of a large memory size, high clock frequency, and flexible voltage range makes it suitable for a wide range of applications. The surface-mount 8USON package and tape and reel (TR) packaging ensure it is ideal for compact and automated designs. With its REACH unaffected and RoHS3 compliant status, the GD25VE16CEIGR adheres to the highest environmental and safety standards. Overall, the GD25VE16CEIGR is a reliable and efficient memory solution for modern electronic systems.