H&D Wireless
HDG200-DN-3

879-HDG200-DN-3
PDF Datasheet
IC RF TXRX+MCU WIFI 44TQFN

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
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Tech Specifications

Serial Interfaces
SDIO, SPI
Product Status
Active
Power - Output
17dBm
Supplier Device Package
44-QFN SIP (8x8)
Package / Case
44-TQFN Exposed Pad Module
Current - Receiving
49mA
Modulation
-
Voltage - Supply
2.75V ~ 3.6V
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HDG200-DN-3 Description

With a vision to drive innovation and transform industries, the Tray in this HDG200-DN-3 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. H&D Wireless is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This H&D Wireless HDG200-DN-3 falls into the RF Transceiver ICs which is a subset of RF and Wireless. This HDG200-DN-3 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

Are there related or alternative parts for HDG200-DN-3?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
What is HDG200-DN-3?
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