CY7C2564XV18-366BZXC Description
The CY7C2564XV18-366BZXC is a high-performance Static Random Access Memory (SRAM) IC chip manufactured by Infineon Technologies. This memory device is designed to offer robust performance and reliability, making it suitable for a wide range of applications. The CY7C2564XV18-366BZXC features a 72Mbit memory size organized as 2M x 36, with a parallel memory interface that ensures efficient data transfer. It operates within a voltage range of 1.7V to 1.9V and supports a clock frequency of 366 MHz, enabling fast read and write operations. The operating temperature range is 0°C to 70°C (TA), making it suitable for use in standard environmental conditions. The device is packaged in a 165-pin Fine Ball Grid Array (FBGA) and is designed for surface mount applications. It is REACH unaffected, RoHS3 compliant, and has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring compliance with environmental and manufacturing standards.
CY7C2564XV18-366BZXC Features
- High-Speed Performance: With a clock frequency of 366 MHz, the CY7C2564XV18-366BZXC provides rapid data access and transfer, making it ideal for applications requiring high-speed processing.
- Large Memory Capacity: The 72Mbit memory size, organized as 2M x 36, offers substantial storage capacity for complex data sets and applications.
- Parallel Interface: The parallel memory interface ensures efficient and reliable data transfer, supporting high-speed operations and reducing latency.
- Low Power Consumption: Operating within a voltage range of 1.7V to 1.9V, this SRAM IC is designed for low power consumption, making it suitable for energy-efficient systems.
- Wide Operating Temperature Range: The device operates reliably within a temperature range of 0°C to 70°C (TA), ensuring stability and performance in various environmental conditions.
- Surface Mount Compatibility: The surface mount mounting type and 165-pin FBGA package make it easy to integrate into modern printed circuit board (PCB) designs.
- Compliance and Reliability: The CY7C2564XV18-366BZXC is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and manufacturing standards. Additionally, its MSL of 3 (168 hours) ensures reliability during the manufacturing process.
CY7C2564XV18-366BZXC Applications
The CY7C2564XV18-366BZXC is ideal for a variety of applications that require high-speed, high-capacity memory solutions. Some specific use cases include:
- Networking Equipment: High-speed routers, switches, and network interface cards benefit from the fast data access and large memory capacity of this SRAM IC.
- Telecommunications: Base stations and other telecommunication infrastructure can leverage the device's performance to handle large volumes of data efficiently.
- Industrial Control Systems: PLCs (Programmable Logic Controllers) and other industrial control systems require reliable and fast memory solutions to manage complex operations.
- Embedded Systems: High-performance embedded systems in automotive, aerospace, and medical applications can utilize the CY7C2564XV18-366BZXC for its robust performance and reliability.
- Data Processing Systems: Systems requiring fast data processing and storage, such as servers and data centers, can benefit from the high-speed and large memory capacity of this SRAM IC.
Conclusion of CY7C2564XV18-366BZXC
The CY7C2564XV18-366BZXC from Infineon Technologies is a high-performance SRAM IC chip that stands out for its combination of large memory capacity, high-speed operation, and low power consumption. Its wide operating temperature range and surface mount compatibility make it suitable for a variety of applications, from networking equipment to industrial control systems. The device's compliance with environmental and manufacturing standards ensures it meets the needs of modern electronics manufacturing. Overall, the CY7C2564XV18-366BZXC is an excellent choice for applications requiring a reliable, high-speed, and high-capacity memory solution.