Infineon Technologies_CYV15G0402DXB-BGXC
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Infineon Technologies
CYV15G0402DXB-BGXC

702-CYV15G0402DXB-BGXC
IC TELECOM INTERFACE 256BGA

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Tech Specifications

MSL Level
3 (168 Hours)
ECCN
5A991B1
Mounting Type
Surface Mount
Current - Supply
830mA
Product Status
Obsolete
Supplier Device Package
256-L2BGA (27x27)
Standard Package
40 pcs
Series
HOTlink II™
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CYV15G0402DXB-BGXC Description

The Tray for this electronic equipment is available. The packaging way of this CYV15G0402DXB-BGXC is to conserve time, space, energy, and resources. This CYV15G0402DXB-BGXC offers cheap cost, adaptability, dependability, efficiency, and consistency. This CYV15G0402DXB-BGXC is produced by Infineon Technologies and is used in a variety of industries. This manufacturer aspires to rank among the top electronic vendors in the Asia-Pacific region. Additionally, it hopes to contribute significantly to the sector's expansion. This CYV15G0402DXB-BGXC falls under the Telecom category. The most advanced level of this category is Interface IC Chips. IC interfaces differ in terms of device types and applications. Some products are used with buffers, cardbus controllers, and crosspoint switches.

FAQ

What package or case is CYV15G0402DXB-BGXC available in?
CYV15G0402DXB-BGXC is available in the 256-BGA Exposed Pad package / case.
Are there related or alternative parts for CYV15G0402DXB-BGXC?
Is CYV15G0402DXB-BGXC currently in stock?
What is CYV15G0402DXB-BGXC?
What is the mounting type of CYV15G0402DXB-BGXC?
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