Infineon Technologies
MB39C308BGF-G-ERE1

750-MB39C308BGF-G-ERE1
PDF Datasheet
IC REG CONV INTEL 6OUT 208FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Applications
Converter, Intel LPIA Platform VR
ECCN
EAR99
Mounting Type
Surface Mount
Product Status
Discontinued at Digi-Key
Supplier Device Package
208-PFBGA (9x9)
Number of Outputs
6
Series
-
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MB39C308BGF-G-ERE1 Description

MB39C308BGF-G-ERE1 Description

The MB39C308BGF-G-ERE1 is a highly integrated power management IC designed for advanced computing platforms, particularly suited for Intel LPIA (Low Power IA) platforms and converter applications. Manufactured by Infineon Technologies, this IC offers a comprehensive solution for managing multiple power rails in a compact and efficient manner. The device is housed in a 208-pin FBGA package, which is ideal for surface-mount applications, ensuring high reliability and ease of integration into modern electronic systems.

MB39C308BGF-G-ERE1 Features

  • Multiple Outputs: The MB39C308BGF-G-ERE1 features six independent output channels, providing flexibility in power distribution. These outputs support a range of voltages including 5V, 3.3V, 1.5V, and adjustable options, catering to diverse power requirements.
  • Wide Input Voltage Range: With an input voltage range of 5.5V to 12.6V, this IC is designed to operate efficiently across a broad spectrum of input conditions, making it suitable for various power supply configurations.
  • Compliance and Safety: The MB39C308BGF-G-ERE1 adheres to stringent industry standards. It is REACH unaffected and RoHS3 compliant, ensuring environmental safety and regulatory compliance. Additionally, it is classified under ECCN EAR99 and HTSUS 8542.39.0001, facilitating international trade and regulatory adherence.
  • Packaging and Reliability: The device is packaged in a tape and reel format (Tape & Reel - TR), which is ideal for automated assembly processes. It also has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before reflow soldering, enhancing its reliability in manufacturing environments.

MB39C308BGF-G-ERE1 Applications

The MB39C308BGF-G-ERE1 is specifically designed for applications requiring efficient power management and distribution. Its key applications include:

  • Intel LPIA Platform VR: This IC is optimized for Intel Low Power IA platforms, providing a reliable and efficient power solution for modern computing devices.
  • Converters: The device is also suitable for converter applications, where multiple power rails need to be managed efficiently. Its wide input voltage range and multiple output capabilities make it an ideal choice for such applications.

Conclusion of MB39C308BGF-G-ERE1

The MB39C308BGF-G-ERE1 by Infineon Technologies stands out as a versatile and reliable power management IC, offering multiple output channels and a wide input voltage range. Its compliance with industry standards and environmental regulations ensures it meets the demands of modern electronics manufacturing. Whether used in Intel LPIA platforms or converter applications, this IC provides a robust and efficient solution for managing power distribution. Its compact 208-pin FBGA package and surface-mount compatibility further enhance its appeal for integration into advanced computing systems.

FAQ

What is the mounting type of MB39C308BGF-G-ERE1?
MB39C308BGF-G-ERE1 uses a Surface Mount mounting style based on the listed product specifications.
What package or case is MB39C308BGF-G-ERE1 available in?
What is MB39C308BGF-G-ERE1?
What voltage specification is listed for MB39C308BGF-G-ERE1?
What operating temperature range does MB39C308BGF-G-ERE1 support?
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