Infineon Technologies (formerly Cypress / Spansion)
S25FL128SAGMFI013
128M‑bit (16M x 8) SPI NOR Flash Memory · 2.7V – 3.6V Supply · 133 MHz Clock · SOIC‑16 (300 mil) · Industrial Temperature
🗂️ 128Mbit NOR Flash (16MB) ⚡ 2.7V – 3.6V Supply ⏱️ 133 MHz Clock 🔌 SPI / Quad I/O / DDR 🌡️ -40°C to +85°C (Industrial)
📖 Product Overview
The S25FL128SAGMFI013 is a 134,217,728‑bit (128Mbit) Serial NOR Flash memory device from Infineon Technologies (formerly Cypress/Spansion), organized as 16,777,216 words × 8 bits (16M x 8). It is part of the FL‑S family, built on 65‑nm MirrorBit™ technology with Eclipse™ architecture, offering a high‑performance, low‑pin‑count, and power‑efficient non‑volatile storage solution for embedded systems, industrial control, automotive electronics, and consumer devices[reference:0][reference:1].
The device operates over a supply voltage range of 2.7V to 3.6V and supports Standard SPI, Dual SPI, Quad SPI, and DDR (Double Data Rate) read modes, providing flexible bus width configurations and high data throughput[reference:2][reference:3]. It achieves a maximum clock frequency of 133 MHz (with data rates up to 532 Mbit/s in Quad I/O mode), enabling fast read operations and efficient instruction execution directly from the flash memory (execute‑in‑place – XIP)[reference:4][reference:5].
The S25FL128SAGMFI013 is housed in a standard 16‑pin SOIC (300 mil / 7.50mm body width) package, supplied in Tape & Reel packaging. It is fully RoHS compliant, lead‑free, and supports a minimum of 100,000 program/erase cycles with 20 years of data retention, ensuring long‑term reliability in industrial and consumer applications. The device is designed for industrial temperature operation (-40°C to +85°C), ensuring reliable performance in harsh environments[reference:6][reference:7].
📋 Technical Specifications
Memory Density
128 Mbit (134,217,728 bits) / 16 Mbytes
Organisation
16M x 8 (16,777,216 words × 8 bits)
Memory Technology
FLASH - NOR (MirrorBit™, 65nm)
Interface Type
SPI / Dual SPI / Quad SPI / DDR
Clock Frequency (Max)
133 MHz
Quad I/O Data Rate
Up to 532 Mbit/s (133 MHz × 4)
Supply Voltage (Vcc)
2.7V – 3.6V
Active Read Current
25 mA (max at 133 MHz)
Standby Current
70 µA (typical)
Page Size
256 bytes (programmable 256/512 byte buffer)
Sector Size
4KB / 64KB / 256KB (configurable)
Page Program Time (Typ)
250 µs
Endurance
100,000 program/erase cycles (minimum)
Data Retention
20 years (minimum)
✨ Key Features
MirrorBit™ Technology – Stores two data bits per memory array transistor for high density.
Multi‑I/O SPI Support – SPI, Dual SPI, Quad SPI, and DDR read modes[reference:8].
High Speed – 133 MHz clock, Quad I/O data rate up to 532 Mbit/s.
Flexible Erase Architecture – Configurable 4KB, 64KB, or 256KB uniform sectors[reference:9].
Execute‑in‑Place (XIP) – Direct code execution from flash without RAM shadowing[reference:10].
Advanced Security Features – OTP array (1024 bytes), advanced sector protection, password protection[reference:11].
Automatic ECC – Built‑in error correction code with single‑bit error correction[reference:12].
Quad‑Input Page Programming (QPP) – For slow clock systems[reference:13].
Extended Addressing – 24‑bit or 32‑bit address options for high‑density arrays[reference:14].
Industrial Temperature Range – -40°C to +85°C for demanding environments.
Standard SOIC‑16 Package – 300 mil (7.50mm) body width, 1.27mm lead pitch.
RoHS & Lead‑Free – Environmentally friendly, halogen‑free packaging.
🎯 Typical Applications
Embedded Systems & Industrial Control (PLCs, HMIs, Data Loggers) Automotive Electronics (ECUs, Infotainment, Telematics) – AEC‑Q100 variants available[reference:15] Networking Equipment (Routers, Switches, Firewalls) Consumer Electronics (Smart TVs, Printers, Set‑top Boxes, Digital Cameras) Medical Devices & Portable Diagnostics Firmware / Boot Code Storage for MCUs, SoCs & FPGAs Code Shadowing, XIP, and Data Storage[reference:16] IoT Edge Devices & Smart Sensors
Memory Density
128 Mbit
16M x 8 organisation, 16 MB
Quad SPI Bandwidth
66.5 MB/s
Peak data rate @ 133 MHz (532 Mbps)
Package Type
SOIC-16
300 mil (7.50mm) body width, 1.27mm lead pitch
🔍 Part Number Decoding (S25FL128SAGMFI013)
S25 – SPI Flash family.
FL – FL series (MirrorBit™, Eclipse™ architecture).
128S – Density: 128 Mbit.
A – Voltage range: 2.7V – 3.6V.
G – Package: SOIC‑16 (300 mil).
M – Temperature range: Industrial (-40°C to +85°C).
F – Configuration: FL‑S family version.
I013 – Additional configuration / tape & reel packaging.
Alternatives – Extended temperature options available: S25FL128SAGMFIR01 (Industrial Plus, -40°C to +105°C)[reference:17].
📌 Environmental & Regulatory Information
✅ RoHS Compliant: Yes ✅ Lead‑Free (Pb): Yes 🌍 MSL: Level 3 – 168 hours 🔌 ECCN: 3A991B1A 🇺🇸 HTSUS: 8542.32.0051 🏭 Country of Origin: Taiwan / Philippines 📦 Packing: Tape & Reel (1,450 units per reel)[reference:18] ✅ Halogen‑Free: Yes 🔁 Longevity: Active product 🚗 Automotive Variants: AEC‑Q100 Grade 3, Grade 2, Grade 1 available
✅ The S25FL128SAGMFI013 is an active production device from Infineon Technologies. For complete command set, timing diagrams, and detailed electrical characteristics, refer to the official Infineon datasheet.
Information compiled from Infineon product documentation, official datasheets, and JEDEC standards.
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