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S29GL256N10FFI013

S29GL256N10FFI013 Description

The S29GL256N10FFI013 is a high-performance, 256 Mbit Flash memory IC designed by Infineon Technologies. This memory chip features a parallel memory interface and is organized as 32M x 8 or 16M x 16, offering versatile memory configurations to suit various system requirements. The device is housed in a 64FBGA package, making it suitable for surface-mount applications and ensuring a compact footprint on the PCB.

This Flash memory IC operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply design. It boasts an access time of 100 ns and a write cycle time of 100 ns for both word and page operations, ensuring rapid data read and write capabilities. The S29GL256N10FFI013 is classified under ECCN 3A991B1A and is HTSUS coded as 8542.32.0071, indicating its compliance with international trade regulations.

The product is REACH unaffected and ROHS3 compliant, ensuring it meets environmental and safety standards. It has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure period before assembly, which is crucial for manufacturing processes involving reflow soldering.

S29GL256N10FFI013 Features

• Memory Organization: The S29GL256N10FFI013 offers a flexible memory organization of 32M x 8 or 16M x 16, providing a total memory size of 256 Mbit. This configuration allows for efficient use of memory space and bandwidth, making it suitable for applications requiring high-density storage.
• Fast Access and Write Times: With an access time of 100 ns and a write cycle time of 100 ns, this Flash memory IC ensures rapid data retrieval and storage. This high-speed performance is essential for applications that require quick data processing and minimal latency.
• Wide Supply Voltage Range: The device operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply design and compatibility with various power sources.
• Surface-Mount Package: The 64FBGA package is ideal for surface-mount technology (SMT), ensuring a compact and reliable footprint on the PCB. This packaging also enhances thermal performance and mechanical stability.
• Environmental Compliance: The S29GL256N10FFI013 is REACH unaffected and ROHS3 compliant, ensuring it meets stringent environmental and safety standards. This compliance is crucial for manufacturers aiming to produce eco-friendly products.
• Moisture Sensitivity Level: With an MSL of 3 (168 hours), the device can withstand exposure to moisture for up to 168 hours before assembly, making it suitable for manufacturing processes involving reflow soldering.

S29GL256N10FFI013 Applications

The S29GL256N10FFI013 is ideal for a wide range of applications that require high-density, high-speed Flash memory. Some specific use cases include:

• Embedded Systems: The fast access and write times make it suitable for embedded systems that require quick data processing and minimal latency.
• Industrial Control: The robustness and reliability of the device make it ideal for industrial control applications where high-density storage and fast data retrieval are crucial.
• Consumer Electronics: The compact 64FBGA package and surface-mount technology make it suitable for consumer electronics where space is limited and high-density storage is required.
• Telecommunications: The high-speed performance and wide supply voltage range make it suitable for telecommunications applications that require reliable and efficient data storage.

Conclusion of S29GL256N10FFI013

The S29GL256N10FFI013 is a versatile and high-performance Flash memory IC that offers a combination of high-density storage, fast access times, and environmental compliance. Its flexible memory organization, wide supply voltage range, and compact surface-mount package make it suitable for a wide range of applications, from embedded systems to consumer electronics. Despite being marked as obsolete, the S29GL256N10FFI013 remains a reliable choice for applications requiring robust and efficient Flash memory solutions.