Infineon Technologies_S29GL256S11DHV023
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Infineon Technologies
S29GL256S11DHV023

774-S29GL256S11DHV023
PDF Datasheet
IC FLASH 256MBIT PARALLEL 64FBGA
8 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 105°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
16M x 16
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
64-FBGA (9x9)
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S29GL256S11DHV023 Description

S29GL256S11DHV023 Description

The S29GL256S11DHV023 is a high-performance, 256 Mbit Flash memory IC chip designed by Infineon Technologies. This device is part of the S29GL256 family and is optimized for parallel memory interface applications. It features a memory organization of 16M x 16, providing robust storage capabilities a in compact 64FBGA package. The S29GL256S11DHV023 operates within a supply voltage range of 2.7V to 3.6V and offers an access time of 110 ns, ensuring rapid data retrieval. Additionally, it has a write cycle time of 60 ns for both word and page operations, making it highly efficient for data-intensive applications.

S29GL256S11DHV023 Features

  • Memory Size and Organization: The S29GL256S11DHV023 boasts a memory size of 256 Mbit, organized in a 16M x 16 configuration, providing ample storage for complex systems.
  • Parallel Interface: This Flash memory chip utilizes a parallel memory interface, which is ideal for applications requiring high-speed data transfer and efficient memory management.
  • Fast Access and Write Times: With an access time of 110 ns and a write cycle time of 60 ns, the S29GL256S11DHV023 ensures rapid data processing and minimal latency.
  • Surface Mount Technology: The device is designed for surface mount applications, making it suitable for modern, space-constrained designs.
  • Wide Voltage Range: Operating within a voltage range of 2.7V to 3.6V, the S29GL256S11DHV023 offers flexibility in power supply requirements.
  • Compliance and Safety: The S29GL256S11DHV023 is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards.
  • Packaging: Available in a tape and reel (TR) package, it is ideal for automated assembly processes.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the device is well-suited for environments with varying humidity levels.

S29GL256S11DHV023 Applications

The S29GL256S11DHV023 is ideal for a variety of applications that require high-speed, reliable memory solutions. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems that require fast data access and storage, such as automotive control units, industrial automation systems, and IoT devices.
  • Telecommunications: Suitable for telecom infrastructure where rapid data retrieval and storage are critical, such as base stations and network routers.
  • Consumer Electronics: Can be used in consumer electronics like digital cameras, gaming consoles, and smart TVs, where high-speed memory is essential for performance.
  • Medical Devices: Applicable in medical devices that require reliable and fast memory, such as diagnostic equipment and wearable health monitors.

Conclusion of S29GL256S11DHV023

The S29GL256S11DHV023 is a versatile and high-performance Flash memory IC chip that offers significant advantages over similar models. Its fast access and write times, combined with a robust memory organization and parallel interface, make it an excellent choice for applications requiring efficient data management. The wide voltage range and surface mount design further enhance its flexibility and suitability for modern electronic systems. With its compliance with environmental and safety standards, the S29GL256S11DHV023 is a reliable and future-proof solution for a wide range of industries.

FAQ

What is the standard lead time for S29GL256S11DHV023?
The standard lead time for S29GL256S11DHV023 is 8 Weeks.
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