Infineon Technologies_TLE9471ESXUMA1
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Infineon Technologies
TLE9471ESXUMA1

686-TLE9471ESXUMA1
PDF Datasheet
IC SYST BASIS CHIP TSDSO24-1
52 Weeks

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ISO9001
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ISO45001
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Tech Specifications

PCB changed
24
HTS
8542.39.00.60
ECCN (US)
EAR99
PPAP
Unknown
Product Status
Active
Supplier Device Package
PG-TSDSO-24-1
Automotive
Yes
Supplier Package
TSDSO EP
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TLE9471ESXUMA1 Description

TLE9471ESXUMA1 Description

The TLE9471ESXUMA1 is a high-performance System Basis Chip (S)BC designed for automotive applications, specifically tailored for CAN bus communication. Manufactured by Infineon Technologies, this specialized IC is part of the Lite SBC series and is packaged in a TSDSO24-1 surface mount format. It is ideal for surface mount applications and is available in a Tape & Reel (TR) package, ensuring ease of integration into modern automotive electronic systems.

This SBC is designed to meet the stringent requirements of the automotive industry, with a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure period. It is REACH unaffected and RoHS3 compliant, ensuring environmental and regulatory compliance. The product has an active status, indicating its reliability and suitability for current and future automotive projects.

TLE9471ESXUMA1 Features

The TLE9471ESXUMA1 offers several unique features that set it apart from similar models:

  • Automotive Grade: Certified for automotive use, ensuring robustness and reliability in demanding environments.
  • CAN Bus Communication: Optimized for CAN applications, providing efficient and reliable communication within automotive systems.
  • Surface Mount Technology: The surface mount design allows for compact and efficient integration into electronic circuits.
  • Moisture Sensitivity Level 3: With an MSL of 3, the chip can withstand up to 168 hours of exposure, making it suitable for various manufacturing processes.
  • Compliance and Safety: REACH unaffected and RoHS3 compliant, adherence ensuring to environmental and safety standards.
  • Packaging: Available in a Tape & Reel (TR) package, facilitating automated assembly processes.

TLE9471ESXUMA1 Applications

The TLE9471ESXUMA1 is particularly well-suited for automotive applications requiring reliable CAN bus communication. Specific use cases include:

  • Automotive Control Units: Ideal for integrating into various automotive control units where robust communication and control are essential.
  • In-Vehicle Networking: Enhances the reliability and efficiency of in-vehicle networks, ensuring seamless communication between different vehicle systems.
  • Telematics and Infotainment Systems: Provides a reliable basis for telematics and infotainment systems, contributing to enhanced driver experience and vehicle functionality.

Conclusion of TLE9471ESXUMA1

The TLE9471ESXUMA1 is a versatile and reliable System Basis Chip designed to meet the specific needs of the automotive industry. Its automotive-grade certification, optimized CAN bus communication capabilities, and surface mount design make it an ideal choice for a wide range of automotive applications. With its compliance to environmental and safety standards, the TLE9471ESXUMA1 ensures that it meets the highest industry requirements. Whether used in control units, in-vehicle networking, or telematics systems, this SBC offers a robust and efficient solution for modern automotive electronics.

FAQ

What is the standard lead time for TLE9471ESXUMA1?
The standard lead time for TLE9471ESXUMA1 is 52 Weeks.
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What voltage specification is listed for TLE9471ESXUMA1?
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Availability (In Stock : 2183 )
Quantity Unit Price Ext. Price
1+ $3.27360 $3.27
10+ $2.46752 $24.68
25+ $2.26653 $56.66
100+ $2.04512 $204.51
250+ $1.93963 $484.91
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