Intel_10AS032E2F29E2SG
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Intel
10AS032E2F29E2SG

777-10AS032E2F29E2SG
PDF Datasheet
Field Programmable Gate Array, 320000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780
12 Weeks

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
780
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B780
Width
29
Length
29
Temperature Grade
OTHER
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10AS032E2F29E2SG Description

10AS032E2F29E2SG Description

The 10AS032E2F29E2SG is an advanced Embedded IC Chip from Intel's Arria 10 SX series, designed to deliver high performance and reliability in a compact form factor. This System on Chip (SoC) integrates a Cortex-A9 processor running at 1.5GHz, offering robust computational capabilities for a wide range of embedded applications. The chip features a dual-architecture design, combining a powerful MCU with an FPGA, providing flexibility and scalability for complex system designs.

10AS032E2F29E2SG Features

  • High-Speed Processing: The Cortex-A9 processor operates at 1.5GHz, ensuring rapid data processing and efficient execution of complex algorithms.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), the 10AS032E2F29E2SG is suitable for applications in harsh environments.
  • Dual Architecture: The combination of MCU and FPGA architecture allows for both high-level control and low-level hardware customization, making it ideal for applications requiring both flexibility and performance.
  • Substantial RAM: 256KB of RAM provides ample memory for data storage and processing, enhancing the overall system performance.
  • Comprehensive Connectivity Options: The chip supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripherals and networks.
  • Robust Peripherals: Integrated peripherals such as DMA, POR, and WDT ensure efficient data management and system stability.
  • Compliance and Standards: The 10AS032E2F29E2SG is RoHS compliant and REACH unaffected, adhering to environmental and regulatory standards. It also has an ECCN classification of 5A002A1 and an HTSUS code of 8542.39.0001.
  • Packaging and Sensitivity: The chip is packaged in a tray format and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring safe handling and storage.

10AS032E2F29E2SG Applications

The 10AS032E2F29E2SG is ideal for a variety of applications due to its versatile architecture and robust performance. Key use cases include:

  • Industrial Automation: The combination of high-speed processing and extensive connectivity options makes it suitable for controlling complex industrial processes and machinery.
  • Telecommunications: The chip's ability to handle high data throughput and its wide operating temperature range make it ideal for telecom infrastructure, such as base stations and network routers.
  • Medical Devices: The reliability and compliance with regulatory standards make it a good fit for medical equipment that requires precise control and data processing.
  • Automotive Systems: The robustness and wide temperature range make it suitable for automotive applications, such as engine control units and advanced driver-assistance systems (ADAS).

Conclusion of 10AS032E2F29E2SG

The 10AS032E2F29E2SG from Intel stands out as a versatile and high-performance Embedded IC Chip, offering a unique blend of processing power, flexibility, and reliability. Its dual-architecture design, extensive connectivity options, and compliance with industry standards make it a superior choice for a wide range of applications. Whether used in industrial automation, telecommunications, medical devices, or automotive systems, the 10AS032E2F29E2SG delivers exceptional performance and value, making it a standout product in the embedded systems market.

FAQ

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The standard lead time for 10AS032E2F29E2SG is 12 Weeks.
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