Intel_10AX022E4F27I3SG
original

Intel
10AX022E4F27I3SG

696-10AX022E4F27I3SG
PDF Datasheet
Field Programmable Gate Array, 220000-Cell, CMOS, PBGA672, 27 X 27 MM, ROHS COMPLIANT, FBGA-672
12 Weeks

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
672
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B672
Width
27
Length
27
Temperature Grade
INDUSTRIAL
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10AX022E4F27I3SG Description

The Intel 10AX022E4F27I3SG is a high-performance, multi-protocol wireless module that combines Wi-Fi 6E, Bluetooth 5.2, and Thread connectivity in a single, compact form factor. This module is designed to provide reliable and high-speed wireless connectivity for a wide range of applications, including IoT devices, industrial automation, smart homes, and more.

Description:

The Intel 10AX022E4F27I3SG is a M.2 2230 form factor module that supports Wi-Fi 6E, Bluetooth 5.2, and Thread connectivity. It is based on the Intel® Wireless-AC 9462 and Intel® Bluetooth® 5.2 technology, providing high-speed wireless connectivity with low latency and high reliability.

Features:

  1. Wi-Fi 6E support: The module supports Wi-Fi 6E, which provides faster speeds, lower latency, and improved reliability compared to previous Wi-Fi standards. It operates in the 6 GHz band, providing more bandwidth and less interference for high-performance wireless connectivity.
  2. Bluetooth 5.2 support: The module supports Bluetooth 5.2, which offers improved range, data rates, and power efficiency compared to previous Bluetooth standards. It also supports Bluetooth mesh networking for IoT applications.
  3. Thread support: The module supports Thread, a low-power, secure, and reliable mesh networking protocol designed for IoT devices. Thread enables devices to communicate with each other and the internet, providing seamless connectivity for smart home and industrial applications.
  4. M.2 2230 form factor: The compact M.2 2230 form factor makes it easy to integrate the module into a wide range of devices, from small IoT devices to larger industrial systems.
  5. Advanced security features: The module supports advanced security features such as WPA3 and Enhanced Privacy ID (EPID) to protect against cyber threats and ensure the privacy of connected devices.

Applications:

  1. IoT devices: The Intel 10AX022E4F27I3SG is ideal for IoT devices that require high-speed, low-latency, and reliable wireless connectivity, such as smart home devices, industrial sensors, and wearables.
  2. Industrial automation: The module's robust connectivity and support for Thread make it well-suited for industrial automation applications, where devices need to communicate with each other and the internet for monitoring and control.
  3. Smart homes: The module's support for Wi-Fi 6E, Bluetooth 5.2, and Thread enables seamless connectivity for smart home devices, such as smart thermostats, lighting systems, and security cameras.
  4. Enterprise networking: The high-performance wireless connectivity provided by the module makes it suitable for enterprise networking applications, such as wireless access points and networked office devices.
  5. Mobile computing: The module can be used in mobile computing devices, such as laptops and tablets, to provide high-speed wireless connectivity for streaming, gaming, and other bandwidth-intensive applications.

FAQ

What is 10AX022E4F27I3SG?
10AX022E4F27I3SG is a FPGAs from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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