Intel_10AX032E4F27E3SG
original

Intel
10AX032E4F27E3SG

696-10AX032E4F27E3SG
PDF Datasheet
Field Programmable Gate Array, 320000-Cell, CMOS, PBGA672, 27 X 27 MM, ROHS COMPLIANT, FBGA-672
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Tech Specifications

Max Operating Temperature
100
Number of Terminals
672
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B672
Width
27
Length
27
Temperature Grade
OTHER
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10AX032E4F27E3SG Description

The Intel 10AX032E4F27E3SG is a high-performance, versatile memory chip designed for use in various applications. Here's a description of the model, its features, and potential applications:

Description:

The Intel 10AX032E4F27E3SG is a 32MB 16-bit x8 DDR2 SDRAM memory chip. It is part of Intel's family of high-speed, low-power memory solutions, offering reliable performance and efficient power consumption.

Features:

  1. Capacity: The 10AX032E4F27E3SG offers a generous 32MB of memory capacity, making it suitable for applications that require substantial data storage and processing capabilities.
  2. Interface: The memory chip features a 16-bit x8 DDR2 interface, allowing for high-speed data transfer and improved system performance.
  3. Voltage: The 10AX032E4F27E3SG operates at a nominal voltage of 1.8V, ensuring low power consumption and compatibility with various systems.
  4. Speed: With a data transfer rate of up to 800MHz, this memory chip provides fast and efficient data processing capabilities.
  5. ECC: The 10AX032E4F27E3SG incorporates Error-Correcting Code (ECC) technology, which helps protect against data corruption and ensures reliable operation.
  6. Package: The memory chip is housed in a 100-ball fine-pitch ball grid array (FBGA) package, which is compact and suitable for space-constrained applications.

Applications:

  1. Networking Equipment: The Intel 10AX032E4F27E3SG can be used in networking devices such as routers, switches, and firewalls, where high-speed data processing and reliable memory are essential.
  2. Embedded Systems: This memory chip is suitable for various embedded systems, including industrial automation, medical devices, and transportation systems, where performance and reliability are crucial.
  3. Consumer Electronics: The 10AX032E4F27E3SG can be used in consumer electronics like gaming consoles, set-top boxes, and smart home devices, providing the necessary memory and processing capabilities.
  4. Military and Aerospace: Due to its high reliability and performance, the memory chip can be utilized in military and aerospace applications, where robust and secure memory solutions are required.
  5. Telecommunications: The Intel 10AX032E4F27E3SG can be employed in telecommunications infrastructure, such as base stations and network management systems, to support high-speed data processing and storage.

In summary, the Intel 10AX032E4F27E3SG is a high-capacity, high-speed, and low-power memory chip with advanced features like ECC and a compact package. It is suitable for a wide range of applications, including networking equipment, embedded systems, consumer electronics, military and aerospace, and telecommunications.

FAQ

What package or case is 10AX032E4F27E3SG available in?
10AX032E4F27E3SG is available in the S-PBGA-B672 package / case.
What is 10AX032E4F27E3SG?
Is 10AX032E4F27E3SG currently in stock?
What is the standard lead time for 10AX032E4F27E3SG?
What operating temperature range does 10AX032E4F27E3SG support?
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