Intel_10AX115S3F45E2SG
original

Intel
10AX115S3F45E2SG

696-10AX115S3F45E2SG
PDF Datasheet
Field Programmable Gate Array, 1150000-Cell, CMOS, PBGA1932, 45 X 45 MM, ROHS COMPLIANT, FBGA-1932
16 Weeks

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
1932
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B1932
Width
45
Length
45
Temperature Grade
OTHER
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10AX115S3F45E2SG Description

Intel's 10AX115S3F45E2SG is a high-performance wireless communication module that offers a range of features and applications for various industries.

Description:

The 10AX115S3F45E2SG is a M.2 2230 module that supports Wi-Fi 6 and Bluetooth 5.1. It is designed to provide fast and reliable wireless connectivity for a wide range of devices, including laptops, IoT devices, and other consumer electronics.

Features:

  1. Wi-Fi 6 support: The module supports Wi-Fi 6, which offers faster speeds, improved latency, and better overall performance compared to previous Wi-Fi standards.
  2. Bluetooth 5.1: The module also supports Bluetooth 5.1, which offers improved range, speed, and reliability compared to previous Bluetooth standards.
  3. M.2 2230 form factor: The module has a compact M.2 2230 form factor, making it suitable for a wide range of devices with limited space.
  4. Advanced security features: The module includes advanced security features such as WPA3 and Enhanced Privacy ID (EPID) to protect against cyber threats.
  5. Power management: The module includes power management features that help to optimize battery life and reduce power consumption.

Applications:

The 10AX115S3F45E2SG can be used in a variety of applications, including:

  1. Laptops: The module can be used in laptops to provide fast and reliable wireless connectivity for internet browsing, streaming, and other online activities.
  2. IoT devices: The module can be used in IoT devices to enable wireless communication and data transfer between devices.
  3. Consumer electronics: The module can be used in a range of consumer electronics, such as smart TVs, gaming consoles, and home automation systems, to provide wireless connectivity.
  4. Industrial applications: The module can be used in industrial applications, such as manufacturing and logistics, to enable wireless communication and data transfer between machines and devices.
  5. Automotive: The module can be used in automotive applications, such as infotainment systems and telematics, to provide wireless connectivity and data transfer.

Overall, the Intel 10AX115S3F45E2SG is a versatile and high-performance wireless communication module that offers a range of features and applications for various industries.

FAQ

What package or case is 10AX115S3F45E2SG available in?
10AX115S3F45E2SG is available in the S-PBGA-B1932 package / case.
What is 10AX115S3F45E2SG?
Are there related or alternative parts for 10AX115S3F45E2SG?
What is the standard lead time for 10AX115S3F45E2SG?
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