Intel_10AX115S4F45I3SG
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Intel
10AX115S4F45I3SG

696-10AX115S4F45I3SG
PDF Datasheet
IC FPGA 624 I/O 1932FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
68857856
Number of LABs/CLBs
427200
ECCN
3A001A7A
Number of I/O
624
Grade
-
Mounting Type
Surface Mount
Product Status
Active
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10AX115S4F45I3SG Description

Intel's 10AX115S4F45I3SG is a high-performance wireless module that is designed to provide reliable and secure wireless connectivity for a wide range of applications. Here is a description of the model, its features, and potential applications:

Description:

The 10AX115S4F45I3SG is a M.2 2230 form factor wireless module that supports both Wi-Fi 6 (802.11ax) and Bluetooth 5.1. It is manufactured by Intel and is designed for use in a variety of devices, including laptops, desktops, and IoT devices.

Features:

  1. Wi-Fi 6 (802.11ax) support: The module supports the latest Wi-Fi standard, which offers faster speeds, improved reliability, and increased capacity compared to previous generations.
  2. Bluetooth 5.1: The module also supports Bluetooth 5.1, which offers improved range, speed, and broadcast capacity compared to previous versions of Bluetooth.
  3. M.2 2230 form factor: The module has a compact form factor, making it suitable for use in a variety of devices with limited space.
  4. WPA3 security: The module supports the latest WPA3 security protocol, providing strong encryption and protection against cyber threats.
  5. OFDMA and MU-MIMO support: The module supports advanced features like OFDMA and MU-MIMO, which enable more efficient use of the wireless spectrum and improved performance in congested environments.
  6. Target Wake Time (TWT) support: The module supports TWT, which allows devices to schedule their communication during off-peak times, reducing power consumption and extending battery life.

Applications:

  1. Laptops and desktops: The 10AX115S4F45I3SG can be used in laptops and desktops to provide high-speed wireless connectivity and support for the latest wireless standards.
  2. IoT devices: The module's compact form factor and support for Bluetooth 5.1 make it well-suited for use in IoT devices, such as smart home appliances, wearables, and industrial automation equipment.
  3. Enterprise networks: The module's support for WPA3 security and advanced features like OFDMA and MU-MIMO make it suitable for use in enterprise networks, where security and performance are critical.
  4. Gaming and streaming: The high-speed connectivity and low latency provided by Wi-Fi 6 make the 10AX115S4F45I3SG an excellent choice for gaming and streaming applications.
  5. Mobile devices: While the module is primarily designed for use in laptops and IoT devices, it can also be used in mobile devices that support M.2 2230 form factor wireless modules.

In summary, Intel's 10AX115S4F45I3SG is a versatile and high-performance wireless module that supports both Wi-Fi 6 and Bluetooth 5.1. Its compact form factor, advanced features, and strong security make it suitable for a wide range of applications, from laptops and desktops to IoT devices and enterprise networks.

FAQ

What package or case is 10AX115S4F45I3SG available in?
10AX115S4F45I3SG is available in the 1932-BBGA, FCBGA package / case.
Is 10AX115S4F45I3SG currently in stock?
What is the mounting type of 10AX115S4F45I3SG?
What operating temperature range does 10AX115S4F45I3SG support?
What is 10AX115S4F45I3SG?
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