Intel_10AX115U3F45I2SGE2
original

Intel
10AX115U3F45I2SGE2

696-10AX115U3F45I2SGE2
PDF Datasheet
Field Programmable Gate Array, PBGA1932, FBGA-1932

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
1932
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B1932
Width
45
Length
45
Temperature Grade
INDUSTRIAL
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10AX115U3F45I2SGE2 Description

Intel's 10AX115U3F45I2SGE2 is a high-performance wireless communication module that is designed to provide reliable and fast wireless connectivity for a wide range of applications.

Description:

The 10AX115U3F45I2SGE2 is a M.2 2230 form factor module that supports Wi-Fi 6 and Bluetooth 5.1. It is based on Intel's latest wireless technology and provides a high-speed wireless connection with low latency and high reliability.

Features:

Some of the key features of the 10AX115U3F45I2SGE2 include:

  1. Wi-Fi 6 support: The module supports Wi-Fi 6, which provides faster speeds, improved reliability, and increased capacity compared to previous Wi-Fi standards.
  2. Bluetooth 5.1: The module also supports Bluetooth 5.1, which offers improved range, faster data rates, and lower power consumption compared to previous Bluetooth standards.
  3. M.2 2230 form factor: The module has a compact M.2 2230 form factor, making it easy to integrate into a wide range of devices.
  4. Advanced security features: The module includes advanced security features such as WPA3 and 802.1X, which provide robust protection against cyber threats.
  5. High performance: The module delivers high-performance wireless connectivity with speeds up to 1.2 Gbps and low latency, making it ideal for demanding applications such as gaming, streaming, and video conferencing.

Applications:

The 10AX115U3F45I2SGE2 is suitable for a wide range of applications, including:

  1. Laptops and notebooks: The module can be used in laptops and notebooks to provide fast and reliable wireless connectivity for internet access, streaming, and online gaming.
  2. IoT devices: The module's compact size and low power consumption make it ideal for IoT devices such as smart home devices, wearables, and industrial automation equipment.
  3. Embedded systems: The module can be used in embedded systems such as medical devices, point-of-sale terminals, and digital signage to provide reliable wireless connectivity.
  4. Networking equipment: The module can be used in networking equipment such as routers, switches, and access points to provide high-speed wireless connectivity for homes and businesses.

In conclusion, the Intel 10AX115U3F45I2SGE2 is a high-performance wireless communication module that offers a range of features and benefits for a wide range of applications. Its support for Wi-Fi 6 and Bluetooth 5.1, along with its compact form factor and advanced security features, make it an ideal choice for devices that require fast, reliable, and secure wireless connectivity.

FAQ

What is 10AX115U3F45I2SGE2?
10AX115U3F45I2SGE2 is a FPGAs from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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Is 10AX115U3F45I2SGE2 currently in stock?
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