Intel
10AX115U3F45I2SGES

696-10AX115U3F45I2SGES
PDF Datasheet
Field Programmable Gate Array, PBGA1932, 45 X 45 MM, ROHS COMPLIANT, FBGA-1932

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
1932
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B1932
Width
45
Length
45
Temperature Grade
INDUSTRIAL
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10AX115U3F45I2SGES Description

The Intel 10AX115U3F45I2SGES is a high-performance wireless module that provides reliable and fast wireless connectivity for various applications. Here is a description of the model, its features, and potential applications:

Description:

The Intel 10AX115U3F45I2SGES is a 16x30mm M.2 2230 form factor wireless module that supports Wi-Fi 6E and Bluetooth 5.2. It is designed to provide high-speed wireless connectivity and improved performance for a wide range of devices.

Features:

  1. Wi-Fi 6E support: The module supports Wi-Fi 6E, which offers faster speeds, increased capacity, and lower latency compared to previous Wi-Fi standards. This enables a better wireless experience for users.
  2. Bluetooth 5.2: The module supports Bluetooth 5.2, which offers improved range, faster data transmission, and lower power consumption compared to previous Bluetooth versions.
  3. M.2 2230 form factor: The compact size of the module makes it suitable for various devices, including laptops, IoT devices, and other portable devices.
  4. Advanced antenna technology: The module features advanced antenna technology that provides better signal reception and transmission, resulting in improved wireless performance.
  5. Security features: The module supports WPA3 and other advanced security protocols to ensure a secure wireless connection.

Applications:

  1. Laptops and notebooks: The Intel 10AX115U3F45I2SGES can be used in laptops and notebooks to provide high-speed wireless connectivity for internet browsing, streaming, and online gaming.
  2. IoT devices: The module's compact size and advanced wireless capabilities make it suitable for various IoT devices, such as smart home appliances, surveillance cameras, and industrial automation systems.
  3. Embedded systems: The module can be integrated into embedded systems for applications that require reliable and fast wireless connectivity, such as medical devices, point-of-sale systems, and digital signage.
  4. Gaming consoles: The high-speed wireless connectivity provided by the module can enhance the gaming experience on gaming consoles by reducing latency and providing a stable connection for online multiplayer games.
  5. Enterprise networks: The module can be used in enterprise networks to provide fast and secure wireless connectivity for various applications, such as VoIP, video conferencing, and data transfer.

In summary, the Intel 10AX115U3F45I2SGES is a versatile and high-performance wireless module that offers advanced features like Wi-Fi 6E and Bluetooth 5.2 support. Its compact form factor and advanced antenna technology make it suitable for a wide range of applications, from laptops and IoT devices to enterprise networks.

FAQ

What voltage specification is listed for 10AX115U3F45I2SGES?
The listed voltage-related specification for 10AX115U3F45I2SGES is 0.9.
What package or case is 10AX115U3F45I2SGES available in?
What operating temperature range does 10AX115U3F45I2SGES support?
What is 10AX115U3F45I2SGES?
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