Intel_10M08DCF256C8G
original

Intel
10M08DCF256C8G

696-10M08DCF256C8G
PDF Datasheet
Field Programmable Gate Array, 8000-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-256
16 Weeks

Why Choose Us?

Professional Platform

B2B & B2C purchasing

Delivery at full speed

1-2 days delivery

Wide variety

Original manufacturers

365 days guarantee

Responsible quality
APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original
D&B

Tech Specifications

Max Operating Temperature
85
Number of Terminals
256
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B256
Width
17
Length
17
Temperature Grade
OTHER
Show More

10M08DCF256C8G Description

10M08DCF256C8G Description

The 10M08DCF256C8G is an advanced Field-Programmable Gate Array (FPGA) from Intel, designed to deliver exceptional performance and flexibility in a wide range of embedded applications. This IC is part of the renowned MAX® 10 series, known for its robustness and versatility. The device features a total of 387,072 RAM bits, providing ample memory for complex computations and data storage. It is equipped with 500 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), and 8,000 logic elements or cells, enabling the implementation of sophisticated digital circuits. The 10M08DCF256C8G supports 178 I/Os, offering extensive connectivity options for interfacing with various peripherals and systems.

This FPGA operates within a temperature range of 0°C to 85°C (TJ), making it suitable for applications in diverse environmental conditions. The supply voltage range of 1.15V to 1.25V ensures efficient power usage and compatibility with modern low-power systems. The 10M08DCF256C8G is available in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package, which is ideal for surface-mount technology (SMT) and provides a compact footprint for space-constrained designs. The product is RoHS compliant and REACH unaffected, ensuring it meets the highest environmental and safety standards. It also has a Moisture Sensitivity Level (MSL) of 3, allowing for a 168-hour exposure before reflow soldering.

10M08DCF256C8G Features

  • High-Density Logic Elements: With 8,000 logic elements or cells, the 10M08DCF256C8G can implement complex digital circuits with ease.
  • Extensive Memory: The 387,072 total RAM bits provide ample memory for data storage and processing, making it suitable for applications requiring significant data handling.
  • Robust Connectivity: The 178 I/Os offer extensive connectivity options, allowing seamless integration with various peripherals and systems.
  • Wide Operating Temperature Range: The device operates reliably within a temperature range of 0°C to 85°C (TJ), making it suitable for a variety of environmental conditions.
  • Low-Power Operation: The supply voltage range of 1.15V to 1.25V ensures efficient power usage, making it ideal for low-power applications.
  • Compact Packaging: The 256FBGA package is ideal for surface-mount technology (SMT), providing a compact footprint for space-constrained designs.
  • Environmental Compliance: The 10M08DCF256C8G is RoHS compliant and REACH unaffected, ensuring it meets the highest environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the device is suitable for standard reflow soldering processes.

10M08DCF256C8G Applications

The 10M08DCF256C8G is ideal for a wide range of applications due to its high performance, flexibility, and extensive connectivity options. Some specific use cases include:

  • Embedded Systems: The device's high-density logic elements and extensive memory make it suitable for complex embedded systems requiring significant processing power and data handling.
  • Industrial Automation: The robust connectivity options and wide operating temperature range make it ideal for industrial applications where reliability and flexibility are crucial.
  • Consumer Electronics: The compact packaging and low-power operation make it suitable for consumer electronics where space and power efficiency are important considerations.
  • Communication Systems: The extensive I/Os and high-density logic elements enable the implementation of complex communication protocols and signal processing algorithms.

Conclusion of 10M08DCF256C8G

The 10M08DCF256C8G from Intel is a versatile and high-performance FPGA that offers significant advantages over similar models. Its high-density logic elements, extensive memory, and robust connectivity options make it suitable for a wide range of applications. The device's low-power operation, compact packaging, and environmental compliance further enhance its appeal. Whether used in embedded systems, industrial automation, consumer electronics, or communication systems, the 10M08DCF256C8G provides reliable performance and flexibility, making it an excellent choice for modern electronics design.

FAQ

What package or case is 10M08DCF256C8G available in?
10M08DCF256C8G is available in the S-PBGA-B256 package / case.
Is 10M08DCF256C8G currently in stock?
What is 10M08DCF256C8G?
What is the standard lead time for 10M08DCF256C8G?
Are there related or alternative parts for 10M08DCF256C8G?
Quick Quote
ADD TO RFQ LIST

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ