Intel_10M50DCF256I7G
original

Intel
10M50DCF256I7G

696-10M50DCF256I7G
PDF Datasheet
Field Programmable Gate Array, 50000-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-256
16 Weeks

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
256
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B256
Width
17
Length
17
Temperature Grade
INDUSTRIAL
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10M50DCF256I7G Description

10M50DCF256I7G Description

The 10M50DCF256I7G is a high-performance Field-Programmable Gate Array (FPGA) from Intel's MAX® 10 series, designed for embedded and industrial applications requiring low-power operation and high logic density. This surface-mount FPGA is housed in a 256-pin FBGA package and features 50,000 logic elements, 1,677,312 RAM bits, and 178 I/O pins, making it suitable for complex digital designs. Operating within a 1.15V to 1.25V supply range, it balances power efficiency with computational performance. The device is RoHS compliant, adheres to ECCN 3A991D, and has a Moisture Sensitivity Level (MSL) of 3 (168 hours), ensuring reliability in harsh environments.

10M50DCF256I7G Features

  • High Logic Density: 50,000 logic elements and 3,125 LABs/CLBs enable intricate digital signal processing and control logic implementations.
  • Ample Memory Resources: 1.6Mb of embedded RAM supports data-intensive applications without external memory.
  • Versatile I/O: 178 configurable I/O pins facilitate interfacing with sensors, ADCs, and communication protocols (e.g., SPI, I2C).
  • Low-Power Operation: Optimized for 1.2V core voltage, ideal for battery-powered or energy-sensitive systems.
  • Industrial Robustness: REACH unaffected and MSL 3-rated for reliability in industrial automation and automotive applications.
  • Compact Footprint: 256-FBGA package saves PCB space while maintaining high performance.

10M50DCF256I7G Applications

  • Embedded Systems: Custom logic for IoT edge devices, leveraging low power and high integration.
  • Industrial Automation: Motor control, PLCs, and real-time monitoring systems due to rugged design and I/O flexibility.
  • Communications: Protocol bridging (UART to Ethernet) and signal processing in telecom infrastructure.
  • Consumer Electronics: Video processing, display controllers, and smart home hubs.
  • Automotive: ADAS sensor fusion and in-vehicle networking, benefiting from its ECCN compliance.

Conclusion of 10M50DCF256I7G

The 10M50DCF256I7G stands out in Intel's MAX® 10 FPGA lineup by combining high logic density, low power consumption, and industrial-grade reliability. Its 178 I/O pins and embedded memory make it a versatile choice for designers needing a balance of performance and efficiency. Whether for industrial control, embedded computing, or automotive systems, this FPGA delivers a scalable, cost-effective solution with minimal external component requirements. Its active product status and RoHS compliance further ensure long-term availability and environmental safety.

FAQ

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The standard lead time for 10M50DCF256I7G is 16 Weeks.
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