Intel_1SG210HU1F50E2VGAS
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Intel
1SG210HU1F50E2VGAS

696-1SG210HU1F50E2VGAS
PDF Datasheet
IC FPGA 704 I/O 2397BGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Number of LABs/CLBs
262500
Number of I/O
704
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2397-FBGA, FC (50x50)
Series
Stratix® 10 GX
Package / Case
2397-BBGA, FCBGA
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1SG210HU1F50E2VGAS Description

Intel's 1SG210HU1F50E2VGAS is a high-performance memory buffer solution designed for use in high-speed data transmission and storage applications. This device is part of Intel's Stratix 10 GX family of FPGAs, which are known for their high performance, low power consumption, and advanced features.

Description:

The 1SG210HU1F50E2VGAS is a high-density FPGA that offers a combination of processing power, memory, and I/O capabilities. It features a 28-nm process technology and is built using Intel's advanced 3D integration technology. The device has a total of 10,000 logic elements (LEs) and 1,024 registers, providing a high level of computational power for complex applications.

Features:

  1. High-performance processing: The 1SG210HU1F50E2VGAS offers a high level of processing power, making it suitable for demanding applications such as data processing, image and video processing, and real-time control systems.
  2. Large memory capacity: The device has a large memory capacity, with up to 3.6 Mbits of on-chip memory and support for external memory interfaces, making it ideal for applications that require high-speed data storage and retrieval.
  3. Advanced I/O capabilities: The 1SG210HU1F50E2VGAS features a wide range of I/O capabilities, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O interfaces, allowing it to interface with a variety of external devices and systems.
  4. Low power consumption: The device is designed to operate at low power levels, making it suitable for energy-sensitive applications such as mobile devices and battery-powered systems.
  5. Robust design: The 1SG210HU1F50E2VGAS is built using Intel's advanced 3D integration technology, which provides a robust and reliable solution for demanding applications.

Applications:

The 1SG210HU1F50E2VGAS is suitable for a wide range of applications that require high-performance processing, large memory capacity, and advanced I/O capabilities. Some potential applications include:

  1. High-speed data transmission: The device's high-speed transceivers and multi-gigabit transceivers make it ideal for applications that require fast data transmission, such as telecommunications and networking systems.
  2. Image and video processing: The high processing power and large memory capacity of the 1SG210HU1F50E2VGAS make it suitable for applications that involve complex image and video processing, such as surveillance systems and multimedia streaming.
  3. Real-time control systems: The device's low latency and high reliability make it well-suited for real-time control systems, such as industrial automation and robotics.
  4. Data storage and retrieval: The large memory capacity and support for external memory interfaces make the 1SG210HU1F50E2VGAS ideal for applications that require high-speed data storage and retrieval, such as database management systems and data analytics.
  5. Mobile devices and battery-powered systems: The low power consumption of the device makes it suitable for use in mobile devices and battery-powered systems, such as wearable technology and portable data acquisition systems.

FAQ

What operating temperature range does 1SG210HU1F50E2VGAS support?
1SG210HU1F50E2VGAS has an operating temperature range of 0°C ~ 100°C (TJ).
Are there related or alternative parts for 1SG210HU1F50E2VGAS?
What package or case is 1SG210HU1F50E2VGAS available in?
What is 1SG210HU1F50E2VGAS?
What voltage specification is listed for 1SG210HU1F50E2VGAS?
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