Intel_1SG250HH3F55E3XG
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Intel
1SG250HH3F55E3XG

696-1SG250HH3F55E3XG
PDF Datasheet
IC FPGA 1160 I/O 2912BGA
12 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Number of LABs/CLBs
312500
Number of I/O
1160
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2912-FBGA, FC (55x55)
Series
Stratix® 10 GX
Package / Case
2912-BBGA, FCBGA
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1SG250HH3F55E3XG Description

Intel's 1SG250HH3F55E3XG is a high-performance memory module designed for use in servers and data centers. This module offers a number of features that make it an ideal choice for businesses and organizations that require high-speed, reliable memory solutions.

Description:

The 1SG250HH3F55E3XG is a DDR4 memory module with a capacity of 16GB. It operates at a speed of 3200MHz and has a CAS latency of 22. This module is unbuffered and is designed to be used in conjunction with a registered memory buffer (RMB) or load-reduced memory buffer (LR-DIMM).

Features:

  • High-speed DDR4 memory technology
  • 16GB capacity
  • 3200MHz speed
  • CAS latency of 22
  • Unbuffered design
  • Requires RMB or LR-DIMM for use

Applications:

The 1SG250HH3F55E3XG is well-suited for use in servers and data centers where high-speed, reliable memory is critical. It can be used in a variety of applications, including:

  • Database management systems
  • High-performance computing (HPC)
  • Cloud computing
  • Data analytics and processing
  • Virtualization and virtual desktop infrastructure (VDI)

Overall, the 1SG250HH3F55E3XG is a high-quality memory module that offers excellent performance and reliability for businesses and organizations that require a high-speed memory solution.

FAQ

What package or case is 1SG250HH3F55E3XG available in?
1SG250HH3F55E3XG is available in the 2912-BBGA, FCBGA package / case.
What is 1SG250HH3F55E3XG?
Are there related or alternative parts for 1SG250HH3F55E3XG?
What is the standard lead time for 1SG250HH3F55E3XG?
Is 1SG250HH3F55E3XG currently in stock?
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