Intel_1SX280HN3F43E1VGS3
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Intel
1SX280HN3F43E1VGS3

777-1SX280HN3F43E1VGS3
IC FPGA STRATIX 10 1760FBGA
8 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Speed
1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Product Status
Active
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1SX280HN3F43E1VGS3 Description

1SX280HN3F43E1VGS3 Description

The 1SX280HN3F43E1VGS3 is a high-performance Embedded IC Chip from Intel, specifically designed for demanding applications requiring advanced processing capabilities. This chip belongs to the Stratix® 10 SX series, renowned for its robust architecture and versatile connectivity options. The 1SX280HN3F43E1VGS3 integrates a powerful MCU and FPGA architecture, offering a clock speed of 1.5GHz, which ensures efficient and rapid processing of complex tasks. It features a RAM size of 256KB, providing ample memory for data storage and manipulation. The chip is designed to operate within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of environments. The product is currently active and complies with the REACH regulation, being REACH unaffected. It is packaged in a tray format and has a Moisture Sensitivity Level (MSL) of3 (168 Hours), ensuring safe handling and storage.

1SX280HN3F43E1VGS3 Features

The 1SX280HN3F43E1VGS3 offers a comprehensive suite of features that make it a standout choice for embedded systems. Key features include:

  • Dual Architecture: Combining both MCU and FPGA capabilities, this chip provides flexibility in design and implementation, allowing for both general-purpose processing and highly customized logic functions.
  • High-Speed Processing: With a clock speed of 1.5GHz, the 1SX280HN3F43E1VGS3 ensures rapid execution of tasks, making it ideal for real-time applications.
  • Robust Memory: Equipped with 256KB of RAM, the chip can handle significant amounts of data, ensuring smooth operation even in data-intensive applications.
  • Extensive Connectivity: The chip supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C,/ MMCSD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripherals and systems.
  • Peripheral Support: It includes essential peripherals such as DMA and WDT, enhancing its functionality and reliability.
  • Wide Operating Temperature Range: The ability to operate between 0°C and 100°C (TJ) makes it suitable for applications in diverse environmental conditions.
  • Compliance and Packaging: Being REACH unaffected and packaged in a tray format with an MSL of 3 (168 Hours), the chip ensures compliance with environmental regulations and safe handling.

1SX280HN3F43E1VGS3 Applications

The 1SX280HN3F43E1VGS3 is ideal for a variety of applications due to its versatile features and robust performance. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing, extensive connectivity, and wide operating temperature range makes it suitable for industrial control systems, where reliability and performance are critical.
  • Telecommunications: The chip's ability to handle complex data processing and its extensive connectivity options make it ideal for communication infrastructure, such as base stations and network routers.
  • Automotive Systems: The wide operating temperature range and robust architecture make it suitable for automotive applications, including engine control units and advanced driver-assistance systems (ADAS).
  • Medical Devices: The chip's reliability and compliance with environmental regulations make it a good fit for medical equipment, where precision and safety are paramount.
  • Consumer Electronics: The 1SX280HN3F43E1VGS3 can be used in high-end consumer electronics, such as smart home devices and advanced gaming consoles, where advanced processing capabilities are required.

Conclusion of 1SX280HN3F43E1VGS3

The 1SX280HN3F43E1VGS3 is a versatile and high-performance Embedded IC Chip that stands out due to its unique combination of features and capabilities. Its dual architecture, high-speed processing, and extensive connectivity options make it an excellent choice for a wide range of applications, from industrial automation to consumer electronics. The chip's robust design and compliance with environmental regulations ensure its suitability for diverse environments and industries. For engineers and designers seeking a reliable and powerful solution for their embedded systems, the 1SX280HN3F43E1VGS3 from Intel is a compelling option.

FAQ

What package or case is 1SX280HN3F43E1VGS3 available in?
1SX280HN3F43E1VGS3 is available in the 1760-BBGA, FCBGA package / case.
What operating temperature range does 1SX280HN3F43E1VGS3 support?
Is 1SX280HN3F43E1VGS3 currently in stock?
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