Intel_5AGTMC3D3F27I3N
original

Intel
5AGTMC3D3F27I3N

696-5AGTMC3D3F27I3N
PDF Datasheet
Field Programmable Gate Array, 670MHz, 156000-Cell, CMOS, PBGA672, ROHS COMPLIANT, FBGA-672

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Tech Specifications

Package/Case
FBGA
Data Rate
10.3125Gbps
Lead Free
Lead Free
Max Frequency
800MHz
Max Operating Temperature
100°C
Memory Size
11471Kb
Min Operating Temperature
-40°C
Number of GPIO
336
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5AGTMC3D3F27I3N Description

Intel's 5AGTMC3D3F27I3N is a high-performance programmable logic device that offers a range of features and applications for various industries. Here is a description of the model:

Description:

The 5AGTMC3D3F27I3N is a member of Intel's Agilex FPGA family, which is designed to deliver high performance, low power, and advanced security features. This device is a 3D System-in-Package (SiP) FPGA, which integrates multiple dies within a single package to provide increased functionality and performance.

Features:

  1. High-performance: The 5AGTMC3D3F27I3N offers high-performance logic elements, memory, and I/O resources, making it suitable for demanding applications that require fast processing and data handling.
  2. Low power: The device is designed to consume low power, making it ideal for applications where power efficiency is critical, such as battery-powered devices or data centers.
  3. Advanced security: The Agilex FPGA family includes advanced security features, such as hardware-based encryption and secure boot, to protect sensitive data and ensure the integrity of the system.
  4. 3D integration: The 5AGTMC3D3F27I3N features a 3D System-in-Package design, which allows for increased functionality and performance by integrating multiple dies within a single package.
  5. Versatile I/O: The device offers a wide range of I/O options, including high-speed transceivers, to support various communication protocols and interfaces.
  6. Memory resources: The 5AGTMC3D3F27I3N provides a large amount of on-chip memory resources, including block RAM, register files, and distributed memory, to support complex data processing and storage requirements.

Applications:

  1. Networking: The 5AGTMC3D3F27I3N is well-suited for networking applications, such as routers, switches, and network security appliances, due to its high-performance and low-power features.
  2. Automotive: The device can be used in various automotive applications, such as advanced driver assistance systems (ADAS), infotainment systems, and in-vehicle networking, thanks to its performance, security, and I/O capabilities.
  3. Industrial: The 5AGTMC3D3F27I3N can be used in industrial applications, such as motor control, robotics, and machine vision, where high performance, low power, and advanced security features are required.
  4. Data centers: The device's low power consumption and high performance make it suitable for data center applications, such as storage, compute, and networking.
  5. Edge computing: The 5AGTMC3D3F27I3N can be used in edge computing applications, where data processing and decision-making need to be performed close to the data source, reducing latency and bandwidth requirements.

In summary, Intel's 5AGTMC3D3F27I3N is a versatile and powerful FPGA that offers a range of features and applications, making it suitable for various industries and use cases. Its high-performance, low-power, and advanced security features, combined with its 3D integration and versatile I/O options, make it an ideal choice for demanding applications.

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