Intel_5ASXFB3G4F35C5N
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Intel
5ASXFB3G4F35C5N

777-5ASXFB3G4F35C5N
PDF Datasheet
Field Programmable Gate Array, 622MHz, 350000-Cell, CMOS, PBGA1152, ROHS COMPLIANT, FBGA-1152

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Tech Specifications

Package/Case
FBGA
Core Architecture
ARM
Data Rate
6.375Gbps
Interface
I2C, SPI, USB, Ethernet, MMC, SDIO, SD, UART, USART, EBI/EMI
Max Operating Temperature
85°C
Memory Size
19302KB
Min Operating Temperature
0°C
Mount
Surface Mount
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5ASXFB3G4F35C5N Description

5ASXFB3G4F35C5N Description

The 5ASXFB3G4F35C5N is an advanced Embedded IC Chip from Intel, specifically designed for high-performance applications requiring robust processing capabilities and extensive connectivity options. This IC is part of the Arria V SX series, known for its powerful architecture and versatile features. It operates at a speed of 800MHz, ensuring efficient processing and quick response times. The operating temperature range of 0°C to 85°C (TJ) makes it suitable for a wide range of environmental conditions, enhancing its reliability and durability.

5ASXFB3G4F35C5N Features

Performance and Architecture:

  • Speed: The 5ASXFB3G4F35C5N operates at a speed of 800MHz, providing high-speed processing capabilities suitable for demanding applications.
  • Architecture: It features a dual-architecture design, combining a Microcontroller Unit (MCU) with a Field-Programmable Gate Array (FPGA). This hybrid architecture offers the flexibility of an FPGA with the ease of use of a traditional MCU.
  • RAM Size: Equipped with 64KB of RAM, this IC can handle complex tasks and store significant amounts of data for processing.

Connectivity and Peripherals:

  • Connectivity: The 5ASXFB3G4F35C5N offers a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This extensive connectivity makes it ideal for applications requiring multiple interfaces.
  • Peripherals: It includes essential peripherals such as DMA (Direct Memory Access), POR (Power-On Reset), and WDT (Watchdog Timer), enhancing its functionality and reliability.

Compliance and Packaging:

  • ECCN: The 5ASXFB3G4F35C5N is classified under ECCN 3A001A7A, ensuring compliance with international export regulations.
  • Package: It comes in a Tray package, which is suitable for bulk handling and ensures proper storage and transportation.
  • RoHS Status: This IC is RoHS compliant, adhering to environmental standards and ensuring it is free from hazardous substances.
  • Moisture Sensitivity Level (MSL): With an MSL of 3 (168 Hours), it is designed to withstand moisture exposure during manufacturing processes.

5ASXFB3G4F35C5N Applications

The 5ASXFB3G4F35C5N is ideal for a variety of applications due to its high performance, extensive connectivity, and robust architecture. Some specific use cases include:

  • Industrial Automation: Its high-speed processing and extensive connectivity make it suitable for controlling complex industrial systems and machinery.
  • Embedded Systems: The combination of MCU and FPGA architecture allows for versatile applications in embedded systems, from simple control tasks to complex data processing.
  • Networking: The inclusion of Ethernet and USB OTG connectivity options makes it ideal for networking devices and communication systems.
  • Consumer Electronics: Its ability to handle multiple interfaces and peripherals makes it a good fit for consumer electronics requiring high performance and reliability.

Conclusion of 5ASXFB3G4F35C5N

The 5ASXFB3G4F35C5N from Intel is a versatile and powerful Embedded IC Chip, offering a unique combination of high-speed processing, extensive connectivity, and robust architecture. Despite its obsolete status, it remains a valuable component for applications requiring high performance and reliability. Its wide range of connectivity options and peripherals make it suitable for a variety of industries, from industrial automation to consumer electronics. For those seeking a reliable and high-performance solution, the 5ASXFB3G4F35C5N is an excellent choice.

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