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Tech Specifications
Package/Case
BGA
Core Architecture
ARM
Data Rate
3.125Gbps
Interface
I2C, SPI, USB, Ethernet, MMC, SDIO, SD, UART, USART, EBI/EMI
Max Operating Temperature
100°C
Memory Size
6191KB
Min Operating Temperature
-40°C
Number of Logic Blocks (LABs)
4150.9
5CSXFC6D6F31I7NES Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SX FPGA - 110K Logic Elements 800MHz 896-FBGA (31x31)
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