Intel_5SGSMD3E1H29C1WN
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Intel
5SGSMD3E1H29C1WN

696-5SGSMD3E1H29C1WN
IC FPGA 360 I/O 780HBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
13312000
Number of LABs/CLBs
89000
ECCN
OBSOLETE
Number of I/O
360
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
780-HBGA (33x33)
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5SGSMD3E1H29C1WN Description

Intel's 5SGSMD3E1H29C1WN is a high-performance, low-power, and highly-integrated wireless communication module designed for 5G NR (New Radio) and LTE-A Pro networks. This module is part of Intel's FlexRAN family and is designed to meet the demands of next-generation wireless networks.

Description:

The 5SGSMD3E1H29C1WN is a compact, high-performance module that supports a wide range of frequency bands and network technologies. It is designed to provide high-speed data connectivity and low latency for a variety of applications, including IoT devices, industrial automation, and automotive systems.

Features:

  1. Support for 5G NR and LTE-A Pro networks: The module supports a wide range of frequency bands and network technologies, including 5G NR, LTE-A Pro, and legacy 3G and 2G networks.
  2. Compact form factor: The module has a compact form factor, making it suitable for a wide range of applications, including IoT devices, industrial automation, and automotive systems.
  3. High-speed data connectivity: The module supports high-speed data connectivity, with download speeds of up to 2 Gbps and upload speeds of up to 1 Gbps.
  4. Low latency: The module provides low latency, making it suitable for applications that require real-time data processing and communication.
  5. Advanced security features: The module includes advanced security features, including hardware-based encryption and secure boot, to protect against cyber threats.
  6. Global coverage: The module supports a wide range of frequency bands and network technologies, making it suitable for global deployment.

Applications:

The 5SGSMD3E1H29C1WN is suitable for a wide range of applications, including:

  1. IoT devices: The module's compact form factor and support for a wide range of frequency bands make it ideal for IoT devices, such as smart home appliances, wearable devices, and industrial sensors.
  2. Industrial automation: The module's high-speed data connectivity and low latency make it suitable for industrial automation applications, such as robotics, machine-to-machine communication, and remote monitoring.
  3. Automotive systems: The module's advanced security features and global coverage make it suitable for automotive systems, such as infotainment systems, telematics, and advanced driver assistance systems (ADAS).
  4. Network infrastructure: The module can be used in network infrastructure applications, such as small cell base stations, distributed antenna systems (DAS), and remote radio heads (RRH).
  5. Mobile devices: The module can be used in mobile devices, such as smartphones, tablets, and laptops, to provide high-speed data connectivity and low latency.

Overall, the Intel 5SGSMD3E1H29C1WN is a versatile and high-performance module that can be used in a wide range of applications, from IoT devices to network infrastructure. Its support for 5G NR and LTE-A Pro networks, compact form factor, and advanced security features make it an ideal choice for next-generation wireless networks.

FAQ

What voltage specification is listed for 5SGSMD3E1H29C1WN?
The listed voltage-related specification for 5SGSMD3E1H29C1WN is 0.87V ~ 0.93V.
Is 5SGSMD3E1H29C1WN currently in stock?
What operating temperature range does 5SGSMD3E1H29C1WN support?
What is the mounting type of 5SGSMD3E1H29C1WN?
What is 5SGSMD3E1H29C1WN?
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