Intel_5SGSMD3E3H29C2L
original

Intel
5SGSMD3E3H29C2L

696-5SGSMD3E3H29C2L
PDF Datasheet
Field Programmable Gate Array, 236000-Cell, CMOS, PBGA780, HBGA-780

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Tech Specifications

Package/Case
HBGA
Data Rate
14.1Gbps
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
15.72Mb
Min Operating Temperature
0°C
Number of GPIO
360
Number of I/Os
360
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5SGSMD3E3H29C2L Description

Intel's 5SGSMD3E3H29C2L is a high-performance, compact, and versatile wireless module designed for various applications, including industrial IoT, smart cities, and connected vehicles. This module is based on the Intel® Xeon® D-2100 processor and integrates multiple communication technologies, such as 5G NR, GNSS, and Wi-Fi 6.

Description:

The 5SGSMD3E3H29C2L is a small form factor module that combines the power of Intel's Xeon D-2100 processor with advanced wireless communication capabilities. It is designed to support a wide range of applications, from industrial IoT to smart cities and connected vehicles. The module is built to meet the demands of modern connected devices, providing high-speed data transfer, low latency, and reliable connectivity.

Features:

  1. Intel® Xeon® D-2100 Processor: The module is powered by the Intel® Xeon® D-2100 processor, which provides high-performance computing capabilities for demanding applications.
  2. 5G NR Support: The module supports 5G NR, enabling ultra-fast data transfer speeds and low latency for real-time applications.
  3. GNSS Integration: The module features integrated GNSS (Global Navigation Satellite System) support, providing accurate location tracking and geolocation services.
  4. Wi-Fi 6 Support: The module supports Wi-Fi 6, offering high-speed wireless connectivity and improved performance in congested environments.
  5. Compact Form Factor: The module has a small form factor, making it suitable for a wide range of applications and easy integration into various devices.
  6. Advanced Security Features: The module includes advanced security features, such as hardware-based security and encryption, to protect sensitive data and ensure secure communication.
  7. Robust Operating Temperature Range: The module is designed to operate in a wide range of temperatures, making it suitable for use in harsh environments.

Applications:

  1. Industrial IoT: The 5SGSMD3E3H29C2L can be used in industrial IoT applications, such as remote monitoring and control of machinery, predictive maintenance, and real-time data analytics.
  2. Smart Cities: The module can be used in smart city applications, such as traffic management, public safety, and environmental monitoring.
  3. Connected Vehicles: The 5SGSMD3E3H29C2L can be used in connected vehicle applications, such as infotainment systems, telematics, and advanced driver assistance systems (ADAS).
  4. Edge Computing: The module can be used for edge computing applications, where data processing and analytics are performed at the edge of the network, reducing latency and improving performance.
  5. Robotics and Automation: The module can be used in robotics and automation applications, such as autonomous mobile robots, drones, and industrial automation systems.

In summary, Intel's 5SGSMD3E3H29C2L is a powerful and versatile wireless module that combines the performance of Intel's Xeon D-2100 processor with advanced wireless communication technologies. It is designed to support a wide range of applications, from industrial IoT to smart cities and connected vehicles, providing high-speed data transfer, low latency, and reliable connectivity.

FAQ

What package or case is 5SGSMD3E3H29C2L available in?
5SGSMD3E3H29C2L is available in the HBGA package / case.
What voltage specification is listed for 5SGSMD3E3H29C2L?
Is 5SGSMD3E3H29C2L currently in stock?
What operating temperature range does 5SGSMD3E3H29C2L support?
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